 | | AX250-FGG484I | Microchip Technology | IC FPGA 248 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,114 | |
 | | AX250-FGG484M | Microchip Technology | IC FPGA 248 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -55°C – 125°C | Number of Logic Elements/Cells: 4224 | 153 | |
 | | AX250-PQ208M | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 208-PQFP (28×28) | 741 | |
 | | AX250-PQG208M | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 208-PQFP (28×28) | 138 | |
| N/A | | AX500-1CQ208M | Microchip Technology | IC FPGA 115 I/O 208CQFP | FPGAs | 208-CQFP (75x75) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Package / Case: 208-BFCQFP with Tie Bar Supplier Device Package: 208-CQFP (75×75) | 30 | |
 | | AX500-1FG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,028 | |
 | | AX500-1FG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,377 | |
 | | AX500-1FG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -55°C – 125°C | Number of Logic Elements/Cells: 8064 | 992 | |
 | | AX500-1FG676 | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | 0°C – 70°C | Number of Logic Elements/Cells: 8064 | 1,164 | |
 | | AX500-1FG676I | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,312 | |
| N/A | | AX500-1FG676M | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 676-FBGA (27×27) | 831 | |
 | | AX500-1FGG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of Logic Elements/Cells: 8064 | 1,123 | |
 | | AX500-1FGG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 258 | |
 | | AX500-1FGG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,483 | |
 | | AX500-1FGG676 | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | 0°C – 70°C | Number of Logic Elements/Cells: 8064 | 295 | |
 | | AX500-1FGG676I | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,689 | |
 | | AX500-1FGG676M | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 676-FBGA (27×27) | 707 | |
 | | AX500-1PQ208 | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425 V - 1.575 V | 0°C – 70°C | Number of Logic Elements/Cells: 8064 | 1,763 | |
 | | AX500-1PQ208I | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 192 | |
 | | AX500-1PQ208M | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 208-PQFP (28×28) | 1,444 | |