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Total Products: 6,272
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
STM32MP157AAA3STM32MP157AAA3STMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
135
STM32MP157AAA3TSTM32MP157AAA3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,222
STM32MP157AAB3STM32MP157AAB3STMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,555
STM32MP157AAB3TSTM32MP157AAB3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
100
STM32MP157AAC3STM32MP157AAC3STMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
650
STM32MP157AAC3TSTM32MP157AAC3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,289
STM32MP157AAD3STM32MP157AAD3STMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,997
STM32MP157AAD3TSTM32MP157AAD3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
900
STM32MP157CAA3STM32MP157CAA3STMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,052
STM32MP157CAA3TSTM32MP157CAA3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,927
STM32MP157CAB3STM32MP157CAB3STMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,228
STM32MP157CAB3TSTM32MP157CAB3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
279
STM32MP157CAC3STM32MP157CAC3STMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
421
STM32MP157CAC3TSTM32MP157CAC3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
259
STM32MP157CAD3STM32MP157CAD3STMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
498
STM32MP157CAD3TSTM32MP157CAD3TSTMicroelectronicsIC MPU STM32MP1 650MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
1,042
STM32MP157DAA1STM32MP157DAA1STMicroelectronicsIC MPU STM32MP1 800MHZ 448LFBGAMicroprocessors448-LFBGA (18x18)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
448-LFBGA
Supplier Device Package:
448-LFBGA (18×18)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
960
STM32MP157DAB1STM32MP157DAB1STMicroelectronicsIC MPU STM32MP1 800MHZ 354LFBGAMicroprocessors354-LFBGA (16x16)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
354-LFBGA
Supplier Device Package:
354-LFBGA (16×16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
766
STM32MP157DAC1STM32MP157DAC1STMicroelectronicsIC MPU STM32MP1 800MHZ 361TFBGAMicroprocessors361-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
361-TFBGA
Supplier Device Package:
361-TFBGA (12×12)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
440
STM32MP157DAD1STM32MP157DAD1STMicroelectronicsIC MPU STM32MP1 800MHZ 257TFBGAMicroprocessors257-TFBGA (10x10)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Package / Case:
257-TFBGA
Supplier Device Package:
257-TFBGA (10×10)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
124

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