 | | W9864G6IH-6 | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 636 | |
 | | W9864G6JB-6 | Winbond Electronics | IC DRAM 64MBIT PARALLEL 60VFBGA | Memory | 60-VFBGA (6.4x10.1) | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Write Cycle Time Word Page: N/A | 21 | |
 | | W9864G6JH-5 | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 193 | |
 | | W9864G6JH-6I | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 26 | |
 | | W9864G6JT-6 | Winbond Electronics | IC DRAM 64MBIT PARALLEL 54TFBGA | Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Write Cycle Time Word Page: N/A | 78 | |
 | | W9864G6KH-5 | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 92 | |
 | | W9864G6KH-5 TR | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 613 | |
 | | W9864G6KH-6 | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 123 | |
 | | W9864G6KH-6 TR | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 469 | |
 | | W9864G6KH-6I | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 800 | |
 | | W9864G6KH-6I TR | Winbond Electronics | IC DRAM 64MBIT PAR 54TSOP II | Memory | 54-TSOP II | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: Parallel Memory Organization: 4M x 16 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 64 | |
| N/A | | W9864G6KT-6 | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Organization: 4M x 16 Write Cycle Time Word Page: N/A | 1,053 | |
 | | W9864G6KT-6 TR | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | 0°C ~ 70°C (TC) | Memory Organization: 4M x 16 Write Cycle Time Word Page: N/A | 437 | |
 | | W9864G6KT-6I | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | -40°C ~ 85°C (TC) | Memory Organization: 8M x 8 Write Cycle Time Word Page: N/A | 1,416 | |
 | | W9864G6KT-6I TR | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | -40°C ~ 85°C (TC) | Memory Organization: 8M x 8 Write Cycle Time Word Page: N/A | 106 | |
 | | WF200C | Silicon Labs | IC RF TXRX+MCU WIFI 32QFN | RF Transceiver ICs | 32-QFN (4x4) | 1.8V ~ 3.3V | -40°C ~ 105°C | Serial Interfaces: SDIO, SPI Voltage – Supply: 1.8V ~ 3.3V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 430 | |
 | | WF200CR | Silicon Labs | IC RF TXRX+MCU WIFI 32QFN | RF Transceiver ICs | 32-QFN (4x4) | 1.8V ~ 3.3V | -40°C ~ 105°C | Serial Interfaces: SDIO, SPI Voltage – Supply: 1.8V ~ 3.3V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 849 | |
 | N/A | WF200D | Silicon Labs | IC RF TXRX+MCU WIFI 32QFN | RF Transceiver ICs | 32-QFN (4x4) | 1.62V ~ 3.6V | -40°C ~ 105°C (TA) | Frequency: 2.412GHz ~ 2.484GHz Serial Interfaces: SDIO, SPI Voltage – Supply: 1.62V ~ 3.6V Current – Receiving: 41.6mA ~ 47.6mA Current – Transmitting: 44.6mA ~ 108mA Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 629 | |
 | N/A | WF200DR | Silicon Labs | IC RF TXRX+MCU WIFI 32QFN | RF Transceiver ICs | 32-QFN (4x4) | 1.62V ~ 3.6V | -40°C ~ 105°C (TA) | Frequency: 2.412GHz ~ 2.484GHz Serial Interfaces: SDIO, SPI Voltage – Supply: 1.62V ~ 3.6V Current – Receiving: 41.6mA ~ 47.6mA Current – Transmitting: 44.6mA ~ 108mA Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 829 | |
 | | WF200SC | Silicon Labs | IC RF TXRX+MCU WIFI 32QFN | RF Transceiver ICs | 32-QFN (4x4) | 1.8V ~ 3.3V | -40°C ~ 105°C | Serial Interfaces: SDIO, SPI Voltage – Supply: 1.8V ~ 3.3V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 32-UFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 1,156 | |