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Total Products: 220,336
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
XC6SLX75-3FGG484C
XC6SLX75-3FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,326
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QUOTE
XC6SLX75-3FGG484I
XC6SLX75-3FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
600
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QUOTE
XC6SLX75-3FGG676C
XC6SLX75-3FGG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
387
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QUOTE
XC6SLX75-3FGG676I
XC6SLX75-3FGG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
408
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
460
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QUOTE
XC6SLX75-L1CSG484C
XC6SLX75-L1CSG484CAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
328
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
1,193
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QUOTE
XC6SLX75-L1CSG484I
XC6SLX75-L1CSG484IAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
328
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
754
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QUOTE
XC6SLX75-L1FG676I
XC6SLX75-L1FG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,074
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QUOTE
XC6SLX75-L1FGG484C
XC6SLX75-L1FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
772
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QUOTE
XC6SLX75-L1FGG484I
XC6SLX75-L1FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,417
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QUOTE
XC6SLX75-N3CSG484C
XC6SLX75-N3CSG484CAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
328
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,577
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QUOTE
XC6SLX75-N3CSG484I
XC6SLX75-N3CSG484IAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
328
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
211
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QUOTE
XC6SLX75-N3FG484C
XC6SLX75-N3FG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
420
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QUOTE
XC6SLX75-N3FG484I
XC6SLX75-N3FG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
575
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QUOTE
XC6SLX75-N3FG676C
XC6SLX75-N3FG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,773
GET A
QUOTE
XC6SLX75-N3FG676I
XC6SLX75-N3FG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
408
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
228
GET A
QUOTE
XC6SLX75-N3FGG484C
XC6SLX75-N3FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,448
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QUOTE
XC6SLX75-N3FGG484I
XC6SLX75-N3FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
911
GET A
QUOTE
XC6SLX75-N3FGG676C
XC6SLX75-N3FGG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
952
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QUOTE
XC6SLX75-N3FGG676I
XC6SLX75-N3FGG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
578
GET A
QUOTE
XC6SLX75T-2CSG484C
XC6SLX75T-2CSG484CAdvanced Micro DevicesIC FPGA 292 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
292
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
145
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QUOTE

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