 | | XC6SLX75T-2CSG484I | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 1,293 | |
 | | XC6SLX75T-2FG484I | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 548 | |
 | | XC6SLX75T-2FG676I | Advanced Micro Devices | IC FPGA 348 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,312 | |
 | | XC6SLX75T-2FGG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 1,302 | |
 | | XC6SLX75T-2FGG484I | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 132 | |
 | | XC6SLX75T-2FGG676C | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 441 | |
 | | XC6SLX75T-2FGG676I | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 510 | |
 | | XC6SLX75T-3CSG484C | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 415 | |
 | | XC6SLX75T-3CSG484I | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 1,112 | |
 | | XC6SLX75T-3FG484I | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 147 | |
 | | XC6SLX75T-3FG676I | Advanced Micro Devices | IC FPGA 348 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 847 | |
 | | XC6SLX75T-3FGG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 1,488 | |
 | | XC6SLX75T-3FGG484I | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 279 | |
 | | XC6SLX75T-3FGG676C | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 38 | |
 | | XC6SLX75T-3FGG676I | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 380 | |
 | | XC6SLX75T-4CSG484C | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 1,762 | |
 | | XC6SLX75T-4FGG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 996 | |
 | | XC6SLX75T-4FGG676C | Advanced Micro Devices | IC FPGA 348 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 813 | |
 | | XC6SLX75T-N3CSG484I | Advanced Micro Devices | IC FPGA 292 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 548 | |
 | | XC6SLX75T-N3FG484C | Advanced Micro Devices | IC FPGA 268 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 651 | |