 | | 5AGXMA5G4F31I3G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.12 V - 1.18 V | -40°C – 100°C | Number of Logic Elements/Cells: 190000 | 403 | |
 | | 5AGXMA5G4F31I3N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.12 V - 1.18 V | -40°C – 100°C | Number of Logic Elements/Cells: 190000 | 570 | |
 | | 5AGXMA5G4F31I5 | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | -40°C – 100°C | Number of Logic Elements/Cells: 190000 | 210 | |
 | | 5AGXMA5G4F31I5G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | -40°C – 100°C | Number of Logic Elements/Cells: 190000 | 1,043 | |
 | | 5AGXMA5G4F31I5N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | -40°C – 100°C | Number of Logic Elements/Cells: 190000 | 781 | |
 | N/A | 5AGXMA5G4F35C4G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 190000 | 729 | |
 | | 5AGXMA5G4F35C4N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 50 | |
 | | 5AGXMA5G4F35C5G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 190000 | 1,404 | |
 | | 5AGXMA5G4F35C5N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 757 | |
| N/A | | 5AGXMA5G4F35I5 | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 1,904 | |
 | | 5AGXMA5G4F35I5G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07V ~ 1.13V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 1,886 | |
 | | 5AGXMA5G4F35I5N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 474 | |
 | N/A | 5AGXMA5G6F31C6G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 1,002 | |
 | | 5AGXMA5G6F31C6N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 856 | |
 | | 5AGXMA5G6F35C6G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 190000 | 1,041 | |
 | | 5AGXMA5G6F35C6N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 190000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 121 | |
| N/A | N/A | 5AGXMA7D4F27C4G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 982 | |
 | | 5AGXMA7D4F27C4N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 195 | |
| N/A | | 5AGXMA7D4F27C5G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 529 | |
 | | 5AGXMA7D4F27C5N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 1,424 | |