| N/A | | 5AGXMA1D6F27C6G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 75000 | 605 | |
 | | 5AGXMA1D6F27C6N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 75000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 9 | |
 | | 5AGXMA1D6F31C6G | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 75000 | 333 | |
 | | 5AGXMA1D6F31C6N | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 75000 | 46 | |
 | | 5AGXMA3D4F27C4G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 594 | |
 | | 5AGXMA3D4F27C4N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 156000 | 855 | |
| N/A | N/A | 5AGXMA3D4F27C5G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 1,541 | |
 | | 5AGXMA3D4F27C5N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 156000 | 936 | |
 | | 5AGXMA3D4F27I3 | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.12V ~ 1.18V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 931 | |
| N/A | N/A | 5AGXMA3D4F27I3G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.12V ~ 1.18V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 706 | |
 | | 5AGXMA3D4F27I3N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.12 V - 1.18 V | -40°C – 100°C | Number of Logic Elements/Cells: 156000 | 1,160 | |
| N/A | N/A | 5AGXMA3D4F27I5G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 758 | |
 | | 5AGXMA3D4F27I5N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | -40°C – 100°C | Number of Logic Elements/Cells: 156000 | 1,882 | |
 | | 5AGXMA3D4F31C4G | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 406 | |
 | | 5AGXMA3D4F31C4N | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 156000 | 842 | |
 | N/A | 5AGXMA3D4F31C5G | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 1,340 | |
 | | 5AGXMA3D4F31C5N | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of Logic Elements/Cells: 156000 | 1,295 | |
 | | 5AGXMA3D4F31I3G | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.12V ~ 1.18V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 1,099 | |
 | | 5AGXMA3D4F31I3N | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.12V ~ 1.18V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 1,575 | |
 | | 5AGXMA3D4F31I5 | Intel | IC FPGA 416 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 156000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 1,695 | |