XCV50E-6FG256I

The XCV50E-6FG256I is an industrial-grade Virtex®-E FPGA offered by AMD. It delivers reprogrammable digital logic with 1.8 V internal operation and a broad I/O complement in a compact 256-ball BGA package.

Designed for applications that require flexible I/O, on-chip memory, and moderate gate and logic density, the device integrates 1,728 logic elements, approximately 65 Kbits of embedded RAM, and 176 I/O pins, with an operating range suited to -40 °C to 100 °C environments.

Key Features

• Core Logic — 1,728 logic elements and 71,693 equivalent gates provide configurable combinatorial and sequential resources for custom digital logic implementations.
• Embedded Memory — 65,536 total RAM bits (approximately 64 Kbits) of on-chip memory for FIFOs, buffers, and small embedded data structures.
• I/O Capacity & Standards — 176 general-purpose I/O pins. Series-level Virtex‑E features include support for multiple high-performance I/O standards and differential signaling options.
• Supply & Power — Internal core supply range specified at 1.71 V to 1.89 V (1.8 V nominal), using a 0.18 µm production process for the family.
• Package & Mounting — 256‑ball FBGA (17 × 17) surface-mount package for high-density board designs and compact footprints.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, suitable for industrial environments requiring extended temperature range.
• Clocking & Performance (Series) — Virtex‑E family characteristics include high internal performance and advanced clock management circuitry at the series level.

Typical Applications

• Industrial Control — Implement custom logic, protocol bridging, and control sequencing where extended temperature range and reprogrammability are required.
• Communications & Interface — Use the device’s flexible I/O and differential signaling support for protocol conversion, interface buffering, and medium-speed data paths.
• Embedded Systems — Integrate glue logic, peripheral controllers, and timing/clock management functions into a single reconfigurable device to reduce PCB complexity.

Unique Advantages

• Reprogrammable Hardware — FPGA architecture enables in-system reconfiguration to iterate designs or deploy field updates without board changes.
• Balanced Logic and Memory — A combination of 1,728 logic elements and approximately 64 Kbits of on-chip RAM supports a wide range of mid-density designs.
• Robust Industrial Operation — Specified -40 °C to 100 °C operating range and industrial grading support deployment in demanding environments.
• High I/O Count in Compact Package — 176 I/Os in a 256-FBGA (17×17) package enable dense I/O routing while preserving a small board footprint.
• Precise Supply Window — Narrow core voltage specification (1.71–1.89 V) simplifies power-supply design for consistent logic behavior.

Why Choose XCV50E-6FG256I?

The XCV50E-6FG256I positions itself as a flexible, industrial-grade FPGA solution for designers who need moderate logic density, embedded memory, and a high I/O count in a compact BGA package. Its 1.8 V internal operation and extended temperature rating make it suitable for embedded and industrial applications requiring reliable reprogrammable logic.

Choose this device when your design benefits from on-chip configurability, a balance of logic and RAM resources, and the ability to support a variety of I/O standards while maintaining a compact board footprint.

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