XCV50E-6PQ240C

The XCV50E-6PQ240C is a Virtex®-E series Field Programmable Gate Array (FPGA) IC from AMD supplied in a 240-BFQFP surface-mount package. It implements a 1.8 V internal core with a supply range of 1.71 V to 1.89 V and is specified for commercial temperature operation.

Designed for mid-density programmable logic and interface tasks, this device provides a balance of logic resources, on-chip RAM, and flexible I/O suitable for system logic, high-speed interface bridging, and embedded system designs that require reprogrammability and high I/O bandwidth.

Key Features

• Core / Process Virtex-E family architecture with a 1.8 V internal supply (VCCINT) and a 0.18 μm, 6-layer metal process designed for low-power operation.
• Logic Capacity 1,728 logic elements delivering approximately 71,693 equivalent gates for implementing combinational and sequential logic functions.
• Embedded Memory 65,536 bits of on-chip RAM (total embedded memory) for distributed memory and small data buffers.
• I/O and Interface Support 158 I/O pins; Virtex‑E family supports a wide range of high-performance interface standards including differential signalling (LVDS, BLVDS, LVPECL) and PCI-compliant 3.3 V operation as described in the Virtex‑E specification.
• Clock Management Family-level clock management features include multiple fully digital DLLs that support clock multiply/divide and duty-cycle control for high-speed interfaces.
• Power and Configuration Operates from a 1.71 V to 1.89 V core supply and supports SRAM-based in-system configuration for unlimited re-programmability.
• Package & Reliability 240-BFQFP (240-PQFP 32×32) surface-mount package; commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-Speed Interface Bridging Implement protocol conversion, bus glue logic, and I/O interfacing where flexible I/O standards and differential signalling support are required.
• Memory Interface and Controllers Use embedded RAM and the Virtex‑E memory hierarchy to prototype or implement controllers and buffering for external memory subsystems.
• Embedded System Logic Integrate glue logic, control state machines, and peripheral interfaces for embedded platforms that need reprogrammability and moderate logic capacity.
• PCI and Bus-Based Systems Deploy in 3.3 V PCI-compliant 32/64-bit systems as part of board-level logic implementing bus interface functions and custom peripherals.

Unique Advantages

• Balanced Logic and Memory: 1,728 logic elements paired with 65,536 bits of on-chip RAM provide the right mix for mid-density designs requiring local storage and logic processing.
• Flexible I/O Capability: 158 I/Os and family support for multiple differential and single-ended I/O standards simplify interfacing to a broad set of peripherals and high-speed links.
• In-System Re-programmability: SRAM-based configuration enables design iteration, field updates, and customization without hardware changes.
• Commercial Temperature and RoHS Compliance: Commercial-grade temperature range (0 °C to 85 °C) and RoHS-compliant packaging support standard commercial product deployments.
• Compact Surface-Mount Package: 240-BFQFP (32×32) package supports dense board layouts while maintaining accessible I/O for prototyping and production assemblies.

Why Choose XCV50E-6PQ240C?

The XCV50E-6PQ240C delivers a practical combination of logic density, embedded memory, and flexible I/O in a commercial-grade Virtex‑E FPGA. Its 1.8 V core supply and family-level features—such as advanced clock management and differential I/O support—make it well suited for designers implementing mid-range programmable logic, interface bridging, and embedded control functions where reprogrammability and I/O versatility are important.

This device is appropriate for teams and projects that require a proven SRAM-based FPGA architecture with accessible package options and vendor-supported development flows, enabling design iteration and long-term adaptability in board-level systems.

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