XCV50E-7FG256C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 176 65536 1728 256-BGA |
|---|---|
| Quantity | 810 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 71693 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV50E-7FG256C – Virtex‑E FPGA, 1.8 V, 256‑BGA
The XCV50E-7FG256C is a Virtex‑E series field programmable gate array in a 256‑ball BGA package designed for commercial-grade applications. It delivers reprogrammable, SRAM-based FPGA capability with 1.8 V core operation and a compact 256‑FBGA (17×17) footprint suitable for space-constrained system designs.
Targeted at designs requiring flexible I/O, embedded memory and logic integration, this device is suited for high‑performance interfaces, memory controller prototyping and custom digital logic implementations where on-chip reconfiguration and low-voltage operation are required.
Key Features
- Core logic 1,728 logic elements providing a hardware fabric equivalent to 71,693 gates for implementing custom digital functions and control logic.
- Embedded memory 65,536 bits of on-chip RAM (approximately 64 Kbits) for distributed storage, FIFOs and small buffering tasks.
- I/O and interface flexibility 176 user I/O pins; Virtex‑E architecture supports advanced SelectI/O+ interface standards and differential signalling (LVDS, BLVDS, LVPECL) for high‑speed, source‑synchronous data links.
- Clock management Series-level clock management includes digitally synthesized DLLs and support for high-frequency LVDS/LVPECL inputs to enable precise clocking and DDR timing strategies.
- Supply and thermal Core supply range of 1.71 V to 1.89 V and commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronic systems.
- Package and mounting 256‑FBGA (17×17) surface-mount package for dense board integration and reliable soldered assembly.
- Reprogrammable architecture SRAM-based in-system configurability for unlimited reprogramming and iterative development cycles.
- Standards and reliability RoHS‑compliant manufacturing and 100% factory-tested devices as documented for the Virtex‑E family.
Typical Applications
- High‑speed interface bridging — Use the device’s flexible I/O and differential signalling support to implement protocol conversion and source‑synchronous links between subsystems.
- Memory interface prototyping — Implement and validate custom memory controllers and interface logic leveraging the device’s embedded RAM and series memory architecture.
- Custom digital processing — Deploy the FPGA fabric for bespoke logic functions, control state machines and data path acceleration in embedded systems.
- In‑system reconfigurable designs — Take advantage of SRAM-based in-system configuration to iterate firmware and optimize hardware functions post-deployment.
Unique Advantages
- Programmable flexibility: SRAM-based FPGA fabric enables repeated reconfiguration for design iteration and feature updates without hardware replacement.
- Balanced integration: Combines on-chip logic, embedded RAM and extensive I/O to reduce external components and simplify system architecture.
- Advanced I/O standards support: Series-level SelectI/O+ and differential signalling compatibility facilitate high-bandwidth, reliable interconnects with modern interfaces.
- Commercial temperature and RoHS compliance: Designed for standard commercial environments and manufactured to RoHS standards for regulatory compatibility.
- Compact BGA package: 256‑FBGA (17×17) provides a high pin-count in a compact footprint for space-constrained PCBs.
- Proven ecosystem support: Virtex‑E family features documented development support and toolchains for design productivity and debugging.
Why Choose XCV50E-7FG256C?
The XCV50E-7FG256C delivers a practical balance of logic capacity, embedded memory and flexible I/O in a compact 256‑FBGA package, all operating at a low 1.8 V core supply. It is well suited for engineers building reconfigurable digital systems, interface bridges and memory interface prototypes who need rapid iteration and reliable, factory-tested silicon.
Choosing this Virtex‑E device provides a reprogrammable platform with series-level clocking and I/O capabilities, enabling scalable design development and long-term adaptability within commercial applications.
Request a quote or submit an inquiry for the XCV50E-7FG256C to obtain pricing and availability information for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








