XCV50E-7FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 65536 1728 256-BGA

Quantity 810 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates71693ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV50E-7FG256C – Virtex‑E FPGA, 1.8 V, 256‑BGA

The XCV50E-7FG256C is a Virtex‑E series field programmable gate array in a 256‑ball BGA package designed for commercial-grade applications. It delivers reprogrammable, SRAM-based FPGA capability with 1.8 V core operation and a compact 256‑FBGA (17×17) footprint suitable for space-constrained system designs.

Targeted at designs requiring flexible I/O, embedded memory and logic integration, this device is suited for high‑performance interfaces, memory controller prototyping and custom digital logic implementations where on-chip reconfiguration and low-voltage operation are required.

Key Features

  • Core logic 1,728 logic elements providing a hardware fabric equivalent to 71,693 gates for implementing custom digital functions and control logic.
  • Embedded memory 65,536 bits of on-chip RAM (approximately 64 Kbits) for distributed storage, FIFOs and small buffering tasks.
  • I/O and interface flexibility 176 user I/O pins; Virtex‑E architecture supports advanced SelectI/O+ interface standards and differential signalling (LVDS, BLVDS, LVPECL) for high‑speed, source‑synchronous data links.
  • Clock management Series-level clock management includes digitally synthesized DLLs and support for high-frequency LVDS/LVPECL inputs to enable precise clocking and DDR timing strategies.
  • Supply and thermal Core supply range of 1.71 V to 1.89 V and commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronic systems.
  • Package and mounting 256‑FBGA (17×17) surface-mount package for dense board integration and reliable soldered assembly.
  • Reprogrammable architecture SRAM-based in-system configurability for unlimited reprogramming and iterative development cycles.
  • Standards and reliability RoHS‑compliant manufacturing and 100% factory-tested devices as documented for the Virtex‑E family.

Typical Applications

  • High‑speed interface bridging — Use the device’s flexible I/O and differential signalling support to implement protocol conversion and source‑synchronous links between subsystems.
  • Memory interface prototyping — Implement and validate custom memory controllers and interface logic leveraging the device’s embedded RAM and series memory architecture.
  • Custom digital processing — Deploy the FPGA fabric for bespoke logic functions, control state machines and data path acceleration in embedded systems.
  • In‑system reconfigurable designs — Take advantage of SRAM-based in-system configuration to iterate firmware and optimize hardware functions post-deployment.

Unique Advantages

  • Programmable flexibility: SRAM-based FPGA fabric enables repeated reconfiguration for design iteration and feature updates without hardware replacement.
  • Balanced integration: Combines on-chip logic, embedded RAM and extensive I/O to reduce external components and simplify system architecture.
  • Advanced I/O standards support: Series-level SelectI/O+ and differential signalling compatibility facilitate high-bandwidth, reliable interconnects with modern interfaces.
  • Commercial temperature and RoHS compliance: Designed for standard commercial environments and manufactured to RoHS standards for regulatory compatibility.
  • Compact BGA package: 256‑FBGA (17×17) provides a high pin-count in a compact footprint for space-constrained PCBs.
  • Proven ecosystem support: Virtex‑E family features documented development support and toolchains for design productivity and debugging.

Why Choose XCV50E-7FG256C?

The XCV50E-7FG256C delivers a practical balance of logic capacity, embedded memory and flexible I/O in a compact 256‑FBGA package, all operating at a low 1.8 V core supply. It is well suited for engineers building reconfigurable digital systems, interface bridges and memory interface prototypes who need rapid iteration and reliable, factory-tested silicon.

Choosing this Virtex‑E device provides a reprogrammable platform with series-level clocking and I/O capabilities, enabling scalable design development and long-term adaptability within commercial applications.

Request a quote or submit an inquiry for the XCV50E-7FG256C to obtain pricing and availability information for your next design.

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