XCV50E-7PQ240I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 158 65536 1728 240-BFQFP |
|---|---|
| Quantity | 551 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 158 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 71693 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV50E-7PQ240I – Virtex®-E Field Programmable Gate Array (FPGA) IC 158 65536 1728 240-BFQFP
The XCV50E-7PQ240I is an industrial-grade Virtex®-E family FPGA offered by AMD in a 240-pin BFQFP package. It delivers a balanced FPGA architecture with 1.8 V core operation and a mix of logic, on-chip RAM, and flexible I/O suited for embedded and high-speed interface designs.
Typical use cases include system-level glue logic, high-performance I/O bridges, and embedded control functions where reprogrammability, moderate gate count, and industrial temperature operation are required.
Key Features
- Logic Capacity — 1,728 logic elements organized across 384 configurable logic blocks, enabling mid-density FPGA implementations.
- On‑Chip Memory — Approximately 0.0625 Mbits of embedded memory (65,536 total RAM bits) for distributed and block RAM usage.
- I/O Resources — 158 user I/O pins to support a variety of peripheral and interface connections; supports differential signaling standards described for the Virtex‑E family.
- Core Voltage — 1.71 V to 1.89 V supply range for internal logic and memory consistent with the Virtex‑E 1.8 V family.
- Clock Management — Family-level features include multiple fully digital DLLs for clock multiplication/division and duty‑cycle control (Virtex‑E series specification).
- High‑Speed Interface Support — Series-level capability includes support for PCI‑compliant 3.3 V, 32/64-bit, 33/66‑MHz operation and differential I/O standards (LVDS, BLVDS, LVPECL) as documented for Virtex‑E devices.
- Package & Mounting — 240-BFQFP (supplier package listed as 240-PQFP 32×32) in a surface-mount package for standard PCB assembly flows.
- Industrial Temperature — Rated for operation from −40°C to 100°C, suitable for industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- High‑speed interface bridging — Implement PCI and other bus bridges using the device’s family-level PCI support and flexible I/O standards.
- Embedded system control — Use the mix of logic and on‑chip RAM to implement control, protocol handling, and glue logic in industrial systems.
- Communications and data acquisition — Deploy differential I/O and clock management features for source-synchronous and LVDS-based data paths.
- Prototyping and reprogrammable logic — SRAM-based in-system configuration enables iterative development and field updates for mid-density designs.
Unique Advantages
- Balanced mid-density integration: 1,728 logic elements and 65,536 bits of on-chip RAM provide a compact platform for moderate-complexity designs without excessive board-level components.
- Flexible I/O standards: Family-level support for multiple differential and single-ended I/O standards helps simplify interface design to external devices and links.
- Industrial temperature rating: −40°C to 100°C operation supports deployment in industrial environments with wider thermal ranges.
- Configurable clocking: Digital DLLs and clock management features (as provided by the Virtex‑E family) enable precise clocking and DDR-friendly duty-cycle control.
- Standard surface-mount packaging: 240-pin BFQFP in a 32×32 PQFP footprint facilitates integration into common PCB assemblies and manufacturing flows.
Why Choose XCV50E-7PQ240I?
The XCV50E-7PQ240I positions itself as a practical Virtex‑E family FPGA option for designers who need reprogrammable logic, a meaningful complement of embedded memory, and versatile I/O in an industrial-temperature package. Its 1.8 V core operation, family-provided high-speed interface support, and on‑chip clock management make it suitable for embedded, communications, and interface-bridging tasks where moderate gate density and field reconfigurability are required.
For teams developing mid-density systems that require industrial temperature capability and the ability to iterate hardware configurations in-system, this device offers a combination of performance, flexibility, and manufacturability documented in the Virtex‑E series specification.
Request a quote or submit your purchase inquiry for the XCV50E-7PQ240I to receive pricing and availability information tailored to your project requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








