XCV50E-8FG256C

The XCV50E-8FG256C is an SRAM-based Virtex®-E field programmable gate array in a 256-ball FBGA (17×17) package. It provides a versatile, reprogrammable logic fabric with 1728 logic elements, approximately 65 Kbits (65,536 bits) of on-chip RAM and 176 user I/Os for compact, I/O‑dense designs.

Designed for commercial applications, the device operates from a 1.71 V to 1.89 V core supply and supports in-system reconfiguration. Typical use cases include high-performance I/O interfacing, embedded control and prototyping where flexible logic, on-chip memory and a high pin-count package are required.

Key Features

• Core and Logic  1728 logic elements and approximately 71,693 equivalent gates provide programmable combinational and sequential resources for custom logic functions.
• Embedded Memory  Approximately 65 Kbits (65,536 bits) of on-chip RAM for distributed and block memory requirements within user designs.
• I/O Capacity & Flexibility  176 user I/Os delivered from the 256-FBGA package enable high-density interfacing; series documentation highlights high-performance SelectI/O+ technology and broad differential signaling support.
• Clock Management  Series-level clock management features include multiple digital DLLs for clock multiply/divide and duty-cycle control to support synchronous designs.
• Configuration  SRAM-based, in-system reprogrammable configuration for iterative development and field updates.
• Packaging & Mounting  256-ball FBGA (17×17), surface-mount package for compact board-level integration.
• Power  Core supply range of 1.71 V to 1.89 V for the internal logic and memory.
• Operating Conditions & Compliance  Commercial-grade operation from 0 °C to 85 °C. RoHS-compliant.

Typical Applications

• High-speed I/O bridging  Use the device’s high I/O count and series-level differential signaling support to implement protocol adapters and board-level interface logic.
• Embedded system logic  Implement custom control, state machines and peripheral glue logic leveraging the on-chip RAM and reprogrammability.
• Memory interface prototyping  Utilize the device’s embedded memory and clock management features for developing and validating memory interface logic.
• Data aggregation and pre‑processing  Perform real-time data formatting, buffering and simple processing tasks in front-end or intermediate system stages.

Unique Advantages

• Compact, I/O‑dense package: The 256-FBGA (17×17) delivers 176 user I/Os in a compact surface-mount footprint, reducing board area for I/O-heavy designs.
• Reprogrammable development flow: SRAM-based in-system configuration enables iterative design changes and field updates without device replacement.
• On-chip memory resource: Approximately 65 Kbits of embedded RAM simplifies buffering and small data storage needs without external memory.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial-environment deployments.
• Broad tool and series support: The Virtex‑E series documentation describes vendor development-system support, aiding implementation and integration.

Why Choose XCV50E-8FG256C?

The XCV50E-8FG256C positions itself as a reprogrammable, I/O-capable FPGA for commercial applications that require moderate logic density, embedded RAM and a generous I/O count in a compact FBGA package. Its SRAM-based configuration supports iterative development and in-field updates, while the combination of on-chip memory and clock management facilities enables practical implementations of synchronous interfaces and buffering.

This device is suitable for design teams and product developers seeking a proven Virtex‑E family device for interface logic, prototyping and embedded control roles where commercial-grade temperature range, RoHS compliance and a high I/O count are important selection criteria.

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