XCV600-4BG560C

The XCV600-4BG560C is an AMD Virtex® Field Programmable Gate Array (FPGA) supplied in a 560-LBGA exposed-pad metal package. It implements a high-density, SRAM-based programmable logic architecture targeted at complex system designs that require significant on-chip logic, embedded memory and flexible I/O resources.

This device is positioned for commercial applications that benefit from reprogrammability, integrated clock management and multi-standard I/O. Key value comes from its combination of 15,552 logic elements, approximately 98 kbits of on-chip RAM, and a broad I/O count enabling system integration and performance-oriented designs.

Key Features

• Logic Capacity — 15,552 logic elements providing substantial programmable logic resources for medium-to-high complexity designs.
• Embedded Memory — Approximately 98 kbits of total on-chip RAM for fast, local data storage and buffer implementations.
• I/O Density — 404 available I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
• Clock and Timing — Built-in clock-management circuitry with four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets and 24 secondary local clock nets for advanced clock control.
• Arithmetic and DSP Support — Dedicated carry logic and multiplier support for high-speed arithmetic and signal-processing functions.
• Configuration Flexibility — SRAM-based in-system configuration with multiple programming modes, allowing unlimited reprogramming for iterative development and in-field updates.
• Performance — Series-level capabilities include system performance up to 200 MHz and support for 66-MHz PCI compliance.
• Package & Mounting — 560-LBGA exposed-pad metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) optimized for surface-mount assembly.
• Electrical & Environmental — Core supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
• Manufacturing Process — Implemented in a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested for production reliability.

Typical Applications

• Communication Interfaces — Implement protocol bridging, custom bus interfaces and high-speed I/O translation using the device’s multi-standard SelectIO capabilities and abundant I/O.
• Embedded Signal Processing — Use dedicated multipliers and carry logic for arithmetic-heavy signal processing blocks and custom DSP pipelines.
• System Control & Glue Logic — Replace multi-device glue logic with a single reprogrammable FPGA to reduce PCB complexity and consolidate control functions.
• Prototyping & In-System Upgrades — Leverage SRAM-based in-system configuration to iterate hardware designs and deploy firmware updates in the field.

Unique Advantages

• Compact, High-Logic Density: 15,552 logic elements and 661,111 system gates enable substantial functionality in a single footprint, reducing board-level parts count.
• Flexible Clocking Architecture: Multiple DLLs and hierarchical clock nets provide precise timing control for complex synchronous designs.
• Broad I/O Reach: 404 I/O pins support extensive peripheral and memory interfacing without external translators.
• Reprogrammability: SRAM-based configuration with multiple programming modes supports iterative development and field reconfiguration.
• Production-Ready Manufacturing: 0.22 μm, 5-layer-metal process and 100% factory testing help ensure consistent device performance across production lots.
• Compliance & Handling: RoHS compliance and a surface-mount 560-LBGA exposed-pad metal package simplify modern manufacturing and environmental requirements.

Why Choose XCV600-4BG560C?

The XCV600-4BG560C offers a balanced combination of logic capacity, embedded memory and I/O resources suitable for medium-to-complex commercial designs that require in-field reconfigurability and robust clocking features. Its package and supply-voltage range make it compatible with standard surface-mount assembly flows while meeting RoHS requirements.

This device is well suited to engineering teams seeking a scalable, reprogrammable solution for protocol interfacing, signal processing, and system-level integration—backed by established manufacturing process characteristics and comprehensive series-level capabilities.

Request a quote or submit a request for pricing and availability to move your design forward with the XCV600-4BG560C. Provide your requirements and preferred procurement channel for a prompt response.