XCV600-4FG676C

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 444 98304 15552 676-BGA

Quantity 1,613 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O444Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-4FG676C – Virtex® FPGA, 676-BGA, 15,552 Logic Elements

The XCV600-4FG676C is a Virtex® Field Programmable Gate Array (FPGA) IC designed for high-density, high-performance programmable logic applications. This SRAM-based Virtex device delivers 15,552 logic elements, approximately 98 kbits of embedded RAM, and a gate-equivalent complexity of 661,111 system gates, making it suitable for complex digital systems and custom processing tasks.

Built for systems requiring extensive I/O and flexible clocking, the device provides 444 user I/Os, multi-standard SelectIO interfaces, and on-chip clock-management resources. It operates from a core supply of 2.375 V to 2.625 V and supports commercial temperature ranges from 0 °C to 85 °C, with a 676-ball FBGA package (27 × 27 mm) optimized for surface-mount assembly.

Key Features

  • Logic Capacity  15,552 logic elements (CLBs) and approximately 661,111 system gates for high-density programmable logic implementations.
  • Embedded Memory  Total on-chip RAM of 98,304 bits (approximately 98 kbits) with configurable LUT-based RAM options and dedicated 4k-bit synchronous dual-ported block RAMs.
  • I/O and Interfaces  444 user I/Os with Multi-standard SelectIO support to interface with a variety of external memory and peripheral devices.
  • Clocking and Timing  Built-in clock-management with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control.
  • Configuration and Reprogramming  SRAM-based in-system configuration with unlimited re-programmability and four supported programming modes (including master and slave serial, SelectMAP™, and JTAG).
  • Performance and Standards  Designed for system performance up to 200 MHz and includes 66-MHz PCI compliance with hot-swappable support for Compact PCI, as indicated in family-level specifications.
  • Package and Assembly  676-FBGA package (27 × 27 mm), surface-mount mounting type, and RoHS compliant for modern assembly and regulatory requirements.
  • Process and Manufacturing  Fabricated on a 0.22 μm, 5-layer metal CMOS process and 100% factory tested, per product family documentation.

Typical Applications

  • PCI and Compact PCI Systems  Implements interface logic and custom peripherals for PCI-compliant designs; family-level features include 66-MHz PCI compliance and hot-swap capability for Compact PCI modules.
  • High-density Digital Processing  Suitable for complex custom datapaths, signal processing, and algorithm acceleration using abundant logic elements, dedicated carry logic, and multiplier support.
  • Embedded Memory and Bus Interfaces  Acts as a bridge or controller for external high-performance RAM and ZBTRAM devices using SelectIO interfaces and configurable on-chip RAM structures.
  • In-system Programmable Prototyping  SRAM-based reprogrammability allows iterative development and field updates for system prototypes and evolving designs.

Unique Advantages

  • High logic density: 15,552 logic elements plus 661,111 system gates support complex, feature-rich designs without external ASICs.
  • Large, flexible embedded memory: Approximately 98 kbits of on-chip RAM with LUT-configurable memory and dedicated dual-ported block RAMs for varied memory architectures.
  • Extensive I/O capability: 444 I/Os and Multi-standard SelectIO simplify integration with diverse peripherals and memory devices.
  • Advanced clock management: Four DLLs and hierarchical clock routing enable precise timing control across large designs.
  • In-system reprogrammability: SRAM-based configuration with multiple programming modes supports field updates and iterative development workflows.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation, surface-mount 676-FBGA packaging, and RoHS compliance for mainstream electronic products.

Why Choose XCV600-4FG676C?

The XCV600-4FG676C provides a balanced combination of logic density, embedded memory, and I/O resources for teams building complex digital systems that require in-field reconfiguration and flexible interfacing. Its Virtex architecture and on-chip clock-management features make it well suited for designs that demand careful timing control and modular integration.

Supported by established FPGA development tools and libraries at the family level, this device is a pragmatic choice for commercial applications that need a programmable, high-capacity FPGA with clear electrical and thermal operating parameters and full RoHS compliance.

Request a quote or submit an inquiry to check pricing and availability for the XCV600-4FG676C and to discuss how it fits your next design.

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