XCV600-4FG676I

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 444 98304 15552 676-BGA

Quantity 907 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O444Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-4FG676I – Virtex® Field Programmable Gate Array (FPGA) IC 444 98304 15552 676-BGA

The XCV600-4FG676I is an industrial-grade, SRAM-based Virtex FPGA designed for high-capacity, in-system programmable logic. It provides a programmable fabric with 15,552 logic cells and on-chip embedded memory suitable for advanced control, data processing, and interface applications.

Built on the Virtex architecture, this device targets designs that require reprogrammability, flexible I/O standards, and clock management for synchronous high-speed systems across industrial temperature ranges.

Key Features

  • Logic Capacity — 15,552 logic cells providing a programmable fabric for complex digital designs and system integration.
  • Embedded Memory — Approximately 98 kbits of total on-chip RAM bits for LUT-configured RAM and block RAM usage.
  • I/O — 444 user I/O pins to support a wide variety of external peripherals and interfaces.
  • Clocking and Timing — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets and 24 secondary local clock nets for advanced clock control.
  • Flexible Logic Architecture — Dedicated carry logic, multiplier support, cascade chains for wide functions, abundant registers with clock enable and set/reset options, and internal 3-state bussing for complex arithmetic and control logic.
  • Configurable LUTs and RAM — LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM, or shift registers, plus configurable synchronous dual-ported 4k-bit RAM blocks for hierarchical memory implementations.
  • Multi-standard I/O — SelectIO interfaces supporting multiple high-performance interface standards; the family documentation cites direct connectivity options to ZBTRAM-type devices.
  • In-System Configuration — SRAM-based architecture enables unlimited re-programmability with multiple programming modes (SelectMAP™, JTAG, master/slave serial modes).
  • Package & Mounting — Surface-mount 676-ball BGA (676-FBGA, 27 × 27 mm body) for high-density board integration.
  • Electrical & Environmental — Supply range of 2.375 V to 2.625 V and industrial operating temperature from −40°C to 100°C; RoHS compliant.
  • Quality & Process — 0.22 μm CMOS process with five-layer metal and 100% factory-tested devices.
  • Standards & System Support — Family-level support includes features such as IEEE 1149.1 boundary-scan and design support through Xilinx Foundation/Alliance tool flows; family documentation notes system performance up to 200 MHz and 66-MHz PCI compliance for applicable designs.

Typical Applications

  • PCI/Compact PCI Subsystems — Implement custom logic, bridging, or protocol handling for PCI-based cards; family documentation includes PCI compliance and Compact PCI hot-swap support.
  • High-speed Data Processing — Use the device’s dedicated carry and multiplier logic plus embedded RAM for packet processing, DSP pre-processing, and mid-stream data tasks.
  • Industrial Control & Automation — Industrial-grade temperature range and flexible I/O make the FPGA suitable for control logic, sensor interfacing, and machine I/O aggregation.
  • Memory Interface and Buffering — Configurable RAM and fast interfaces support designs that require tight coupling to external high-performance memory devices.

Unique Advantages

  • Reprogrammable Flexibility: SRAM-based in-system configuration enables design updates and iterative development without hardware changes.
  • Integrated Clock Management: Multiple DLLs and dedicated clock nets simplify timing architecture for multi-clock-domain designs.
  • High Logic Density: 15,552 logic cells provide room for complex state machines, datapaths, and custom accelerators in a single device.
  • Robust Industrial Operation: Specified −40°C to 100°C operating range supports deployment in temperature-demanding environments.
  • Compact, High-density Packaging: 676-ball FBGA package enables dense board-level integration while exposing a large number of user I/Os.
  • Proven Silicon and Test Coverage: Fabricated on a 0.22 μm, 5-layer-metal process and 100% factory tested for production reliability.

Why Choose XCV600-4FG676I?

The XCV600-4FG676I combines substantial logic capacity, embedded memory, and flexible I/O in an industrial-grade Virtex FPGA package. Its on-chip clock management, arithmetic acceleration features, and reprogrammable SRAM fabric make it well suited to engineers implementing complex control systems, data-path acceleration, and system interface functions where in-field updates and deterministic timing are required.

Designed for integration into compact, high-density boards, this device offers a balance of performance, programmability, and industrial operating range, backed by the Virtex family’s toolchain and architectural features to support scalable designs and long-term maintainability.

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