XCV600-4BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 98304 15552 432-LBGA Exposed Pad, Metal

Quantity 1,035 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-4BG432I – Virtex Field Programmable Gate Array (FPGA), 2.375–2.625 V, 432-LBGA

The XCV600-4BG432I is a Virtex-series Field Programmable Gate Array (FPGA) IC from AMD, delivering a high-capacity, reprogrammable logic platform in a compact 432-LBGA exposed-pad package. It combines a large logic fabric with on-chip memory and extensive I/O to address complex digital system designs.

Key on-chip resources include 3,456 CLBs providing 15,552 logic cells, approximately 0.098 Mbits of embedded memory (98,304 total RAM bits), 316 user I/O, and a gate count of 661,111. The device is rated for industrial operation and supports a core supply range of 2.375 V to 2.625 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Architecture  Virtex-family FPGA architecture featuring a regular array of configurable logic blocks (CLBs) and rich routing resources to support large, complex designs.
  • Logic Capacity  3,456 CLBs providing 15,552 logic cells and a device gate count of 661,111, enabling high-density implementation of digital logic.
  • Embedded Memory  Approximately 0.098 Mbits of on-chip RAM (98,304 total RAM bits) and configurable LUT-based RAM/shift-register options for flexible data storage.
  • I/O and Interface Options  316 user I/O pins and multi-standard SelectIO support (series-level feature) for high-performance interfacing to external devices.
  • Clock Management  Built-in clock-management features including four delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets for advanced clock control.
  • Arithmetic and Logic Support  Dedicated carry logic, multiplier support, and cascade chains for efficient implementation of arithmetic and wide-input functions.
  • In-System Configuration  SRAM-based configuration with unlimited re-programmability and multiple programming modes for laboratory, development, and field updates.
  • Package and Thermal  432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) with industrial-grade operating range (−40 °C to 100 °C).
  • Power and Reliability  Core supply range 2.375 V–2.625 V; device is 100% factory tested and RoHS compliant.

Typical Applications

  • Communications and Networking  Implement protocol engines, packet processing, and interface bridging where high logic density and flexible I/O are required.
  • PCI and Compact PCI Systems  Support systems requiring 66‑MHz PCI compliance and hot‑swappable operation (series-level capability documented in the Virtex family).
  • High-Performance Embedded Processing  Use as the programmable heart of embedded platforms that need reconfigurable logic, on-chip memory, and deterministic clocking.
  • Industrial Control and Instrumentation  Deploy in industrial environments that benefit from the device’s industrial temperature rating and robust packaging.
  • Prototyping and In-System Development  Leverage SRAM-based reprogramming and multiple configuration modes for iterative hardware development and field updates.

Unique Advantages

  • High logic density: 15,552 logic cells and 661,111 gates enable implementation of large, complex digital functions on a single device, reducing board-level component count.
  • Flexible on-chip memory: Approximately 0.098 Mbits of embedded RAM plus configurable LUT RAM/shift-register options accelerate local data buffering and state storage.
  • Extensive I/O capability: 316 user I/O pins with multi-standard SelectIO support simplify interfacing to a wide range of peripherals and external memories.
  • Deterministic clocking: Four DLLs and multiple dedicated clock nets provide fine-grained clock control for multi-domain, high-performance designs.
  • Industrial robustness: Industrial-grade temperature range (−40 °C to 100 °C) and an exposed-pad 432-LBGA package support deployment in demanding environments.
  • Reprogrammable and field-updatable: SRAM-based in-system configuration with multiple programming modes enables design iteration and firmware updates without hardware changes.

Why Choose XCV600-4BG432I?

The XCV600-4BG432I positions itself as a high-capacity, reprogrammable logic device for designers who need substantial on-chip resources, deterministic clocking, and flexible I/O in an industrial‑rated package. Its combination of CLB density, embedded memory, and dedicated arithmetic resources supports complex signal processing, protocol handling, and system control implementations.

Backed by the Virtex-series architecture and the family-level development ecosystem, this device is suited to engineering teams that require iterative development, in-system reconfiguration, and robust operation across a broad temperature range—providing a scalable platform for medium-to-large FPGA applications.

Request a quote or submit an inquiry for pricing and availability of the XCV600-4BG432I to evaluate it for your next design.

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