XCV600-4BG432I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 98304 15552 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,035 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 661111 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of XCV600-4BG432I – Virtex Field Programmable Gate Array (FPGA), 2.375–2.625 V, 432-LBGA
The XCV600-4BG432I is a Virtex-series Field Programmable Gate Array (FPGA) IC from AMD, delivering a high-capacity, reprogrammable logic platform in a compact 432-LBGA exposed-pad package. It combines a large logic fabric with on-chip memory and extensive I/O to address complex digital system designs.
Key on-chip resources include 3,456 CLBs providing 15,552 logic cells, approximately 0.098 Mbits of embedded memory (98,304 total RAM bits), 316 user I/O, and a gate count of 661,111. The device is rated for industrial operation and supports a core supply range of 2.375 V to 2.625 V and an operating temperature range of −40 °C to 100 °C.
Key Features
- Core Architecture Virtex-family FPGA architecture featuring a regular array of configurable logic blocks (CLBs) and rich routing resources to support large, complex designs.
- Logic Capacity 3,456 CLBs providing 15,552 logic cells and a device gate count of 661,111, enabling high-density implementation of digital logic.
- Embedded Memory Approximately 0.098 Mbits of on-chip RAM (98,304 total RAM bits) and configurable LUT-based RAM/shift-register options for flexible data storage.
- I/O and Interface Options 316 user I/O pins and multi-standard SelectIO support (series-level feature) for high-performance interfacing to external devices.
- Clock Management Built-in clock-management features including four delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets for advanced clock control.
- Arithmetic and Logic Support Dedicated carry logic, multiplier support, and cascade chains for efficient implementation of arithmetic and wide-input functions.
- In-System Configuration SRAM-based configuration with unlimited re-programmability and multiple programming modes for laboratory, development, and field updates.
- Package and Thermal 432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) with industrial-grade operating range (−40 °C to 100 °C).
- Power and Reliability Core supply range 2.375 V–2.625 V; device is 100% factory tested and RoHS compliant.
Typical Applications
- Communications and Networking Implement protocol engines, packet processing, and interface bridging where high logic density and flexible I/O are required.
- PCI and Compact PCI Systems Support systems requiring 66‑MHz PCI compliance and hot‑swappable operation (series-level capability documented in the Virtex family).
- High-Performance Embedded Processing Use as the programmable heart of embedded platforms that need reconfigurable logic, on-chip memory, and deterministic clocking.
- Industrial Control and Instrumentation Deploy in industrial environments that benefit from the device’s industrial temperature rating and robust packaging.
- Prototyping and In-System Development Leverage SRAM-based reprogramming and multiple configuration modes for iterative hardware development and field updates.
Unique Advantages
- High logic density: 15,552 logic cells and 661,111 gates enable implementation of large, complex digital functions on a single device, reducing board-level component count.
- Flexible on-chip memory: Approximately 0.098 Mbits of embedded RAM plus configurable LUT RAM/shift-register options accelerate local data buffering and state storage.
- Extensive I/O capability: 316 user I/O pins with multi-standard SelectIO support simplify interfacing to a wide range of peripherals and external memories.
- Deterministic clocking: Four DLLs and multiple dedicated clock nets provide fine-grained clock control for multi-domain, high-performance designs.
- Industrial robustness: Industrial-grade temperature range (−40 °C to 100 °C) and an exposed-pad 432-LBGA package support deployment in demanding environments.
- Reprogrammable and field-updatable: SRAM-based in-system configuration with multiple programming modes enables design iteration and firmware updates without hardware changes.
Why Choose XCV600-4BG432I?
The XCV600-4BG432I positions itself as a high-capacity, reprogrammable logic device for designers who need substantial on-chip resources, deterministic clocking, and flexible I/O in an industrial‑rated package. Its combination of CLB density, embedded memory, and dedicated arithmetic resources supports complex signal processing, protocol handling, and system control implementations.
Backed by the Virtex-series architecture and the family-level development ecosystem, this device is suited to engineering teams that require iterative development, in-system reconfiguration, and robust operation across a broad temperature range—providing a scalable platform for medium-to-large FPGA applications.
Request a quote or submit an inquiry for pricing and availability of the XCV600-4BG432I to evaluate it for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








