XCV600-4BG432C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 98304 15552 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,140 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 661111 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of XCV600-4BG432C – Virtex® Field Programmable Gate Array (FPGA) IC, 316 I/Os, 15,552 logic elements
The XCV600-4BG432C is a high-density Virtex® SRAM-based FPGA in a 432-LBGA exposed pad package, designed for system-level programmable logic applications. It provides 15,552 logic elements, approximately 98,304 bits of embedded RAM, and 316 I/O pins to support complex interfaces and high-capacity designs.
Built on a 0.22 μm, 5-layer-metal process and supported by established FPGA development systems, this device targets designers who need reprogrammable, high-performance logic with flexible clocking and multi-standard I/O in a commercial-temperature grade.
Key Features
- Logic Capacity — 15,552 logic elements and an architectural array optimized for place-and-route efficiency to support high-density designs.
- Embedded Memory — Approximately 0.098 Mbits (98,304 bits) of on-chip RAM with configurable LUT-based RAM and dedicated 4k-bit synchronous dual-ported RAM options.
- I/O and Interface Support — 316 user I/O pins and Multi-standard SelectIO™ support for 16 high-performance interface standards, enabling direct connection to compatible memory devices.
- Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
- Arithmetic and Logic Resources — Dedicated carry logic, multiplier support, cascade chains for wide-input functions, and abundant registers with clock enable and set/reset options.
- Configuration and In-System Reprogrammability — SRAM-based configuration with unlimited re-programmability and multiple programming modes (SelectMAP™, serial, JTAG).
- Package and Power — 432-LBGA exposed pad, surface-mount package (432-MBGA, 40×40) with a recommended supply range of 2.375 V to 2.625 V.
- Temperature and Quality — Commercial operating range of 0 °C to 85 °C and 100% factory tested; includes boundary-scan support and a die-temperature sensor diode.
- Process and Test — Implemented in a 0.22 μm, five-layer-metal CMOS process and supported by comprehensive development tools and libraries.
Typical Applications
- PCI and CompactPCI Systems — Supports 66-MHz PCI compliance and hot-swappable CompactPCI implementations for system expansion and interface bridging.
- High-Capacity Programmable Logic — Serves as a mask-programmable gate array alternative for complex logic consolidation and iterative in-system development.
- Memory Interface and High-Speed Data Paths — Configurable RAM structures and SelectIO™ interfaces enable fast interfaces to external high-performance RAM devices.
Unique Advantages
- High logic density: 15,552 logic elements provide the capacity for complex, large-scale designs without external glue logic.
- Flexible, multi-standard I/O: 316 I/O pins with SelectIO™ support accommodate a wide range of interface standards and memory connections.
- Advanced clocking: Four DLLs and hierarchical clock distribution let you implement precise, low-skew clock domains for performance-critical logic.
- Configurable embedded memory: Multiple LUT-based RAM modes and dedicated block RAM enable tailored on-chip storage strategies for buffers, FIFOs, and state machines.
- In-system reprogrammability: SRAM-based configuration and multiple programming modes simplify updates, prototypes, and field changes.
- Proven silicon and tool support: Built on an established process node and supported by FPGA development systems and libraries for streamlined design flow.
Why Choose XCV600-4BG432C?
The XCV600-4BG432C combines substantial logic capacity, flexible embedded memory, and extensive I/O in a compact 432-LBGA package, making it well suited for system designers who require reprogrammable, high-density programmable logic. Its dedicated clock-management resources, multi-standard I/O, and configuration flexibility make it a practical choice for PCI/CompactPCI systems, complex interface bridging, and designs that benefit from in-field updates.
With commercial temperature qualification, RoHS compliance, and 100% factory testing, this device offers a reliable, development-friendly platform backed by established FPGA design tools and libraries for scalable deployment and long-term support.
If you would like pricing, availability, or to request a quote for the XCV600-4BG432C, submit your inquiry and our team will respond with the next steps.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








