XCV600-4HQ240C

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 98304 15552 240-BFQFP Exposed Pad

Quantity 413 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-4HQ240C – Virtex® Field Programmable Gate Array (FPGA), 15,552 logic elements, ~0.098 Mbits RAM, 166 I/O, 240-BFQFP

The XCV600-4HQ240C is an AMD Virtex® SRAM-based Field Programmable Gate Array optimized for high-capacity, high-performance programmable logic designs. It provides a flexible, regularly structured architecture suited to complex digital systems that require in-system reprogrammability and advanced clocking control.

With 15,552 logic elements, approximately 0.098 Mbits of embedded memory and 166 I/O pins in a 240-BFQFP exposed pad package, this commercial-grade FPGA targets applications that demand substantial logic capacity, configurable memory resources and robust I/O connectivity within a compact surface-mount footprint.

Key Features

  • Logic Capacity  Provides 15,552 logic elements and approximately 661,111 system gates for implementing large combinational and sequential logic functions.
  • Embedded Memory  Includes approximately 98,304 bits of on-chip RAM, enabling local data storage and high-speed buffering inside the FPGA fabric.
  • I/O and Connectivity  166 general-purpose I/O pins support diverse interfacing requirements from control signals to parallel/serial links.
  • Clock Management  Built-in clock-management circuitry at the family level includes dedicated delay-locked loops (DLLs) and hierarchical global/local clock distribution for low-skew clocking and advanced timing control.
  • Configurable Logic Fabric  Flexible logic blocks support LUT-based RAM and shift-register configurations, cascade chains for wide-input functions, dedicated carry logic and multiplier support for arithmetic-intensive designs.
  • Packaging and Mounting  240-BFQFP exposed pad (supplier package: 240-PQFP 32×32) in a surface-mount form factor for compact board integration and thermal conduction through the exposed pad.
  • Power and Electrical  Device operates from a supply range of 2.375 V to 2.625 V, suitable for compatible system power rails.
  • Commercial Grade and Temperature  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
  • Reprogrammability and Configuration  SRAM-based architecture enables unlimited re-programmability and multiple programming modes for in-system updates (feature described at the family level).
  • Environmental Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

  • PCI and CompactPCI Systems  Suitable for programmable logic functions in PCI-compliant systems and CompactPCI environments that benefit from hot-swappable or reconfigurable logic at the board level.
  • High-speed Digital Processing  Useful for custom data-paths, signal processing and control logic where substantial on-chip logic and embedded RAM reduce external memory traffic and latency.
  • Interface Bridging and Custom I/O  With 166 I/O pins, the device is effective for protocol bridging, custom interface implementation and board-level glue logic between disparate subsystems.
  • Prototyping and Iterative Design  SRAM reprogrammability supports rapid design iteration and prototyping of complex digital systems without mask-programmed ASIC costs.

Unique Advantages

  • High Logic Density: 15,552 logic elements and ~661,111 gates provide headroom for complex logic integration, reducing the need for multiple discrete devices.
  • Integrated Embedded Memory: Approximately 0.098 Mbits of on-chip RAM enables local buffering and table storage that speed data-paths and reduce external memory dependence.
  • Advanced Clocking Support: Family-level clock-management features including dedicated DLLs and hierarchical clock nets help manage timing across large designs.
  • Compact Surface-Mount Package: 240-BFQFP exposed pad with a 32×32 supplier package footprint balances I/O count and thermal performance for board-level integration.
  • Flexible Configuration: SRAM-based in-system configuration allows multiple programming modes and unlimited re-programmability for design updates and field changes.
  • Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for commercial products.

Why Choose XCV600-4HQ240C?

The XCV600-4HQ240C positions itself as a robust, reprogrammable logic element for commercial systems that require significant logic capacity, embedded memory and flexible I/O in a compact package. Its combination of substantial logic resources, configurable memory primitives and advanced clocking features addresses designs that need on-board customization, rapid iteration and reliable timing control.

Backed by the Virtex family development ecosystem and built around an SRAM-based architecture, this FPGA is suited for engineering teams developing complex digital subsystems, prototype platforms and reconfigurable interface solutions where long-term flexibility and in-system updates are important.

Request a quote or submit a parts inquiry to receive pricing and availability details for XCV600-4HQ240C and to discuss how this FPGA can fit your next design.

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