XCV50E-7FG256I

The XCV50E-7FG256I is an industrial-grade Virtex®-E field programmable gate array (FPGA) in a 256-ball BGA package from AMD. This 1.8 V FPGA delivers a balance of logic capacity, embedded RAM, and flexible I/O to support high-performance interfaces, memory-centric designs, and reprogrammable system logic.

Designed for applications that demand configurable logic, abundant I/O, and on-chip memory, the device combines series-level Virtex‑E capabilities—such as high-speed I/O standards support, integrated clock management, and a SelectRAM+ memory hierarchy—with device-specific attributes like 1728 logic elements and 176 I/O pins.

Key Features

• Logic Capacity — 1728 logic elements provide reprogrammable combinational and sequential resources for custom logic functions.
• On-chip Memory — 65,536 total RAM bits (approximately 0.0625 Mbits) of embedded memory for buffering, FIFOs, and local data storage.
• I/O Density and Flexibility — 176 user I/O pins with SelectI/O+ technology supporting multiple high-performance interface standards and differential signalling options.
• Performance and Timing — Series-level features include up to 130 MHz internal performance (four LUT levels) and support for high-speed differential clocks; device-level performance benefits from Virtex‑E clock management circuitry.
• Advanced Memory and Interface Support — SelectRAM+ memory hierarchy and architecture designed to interface with external memories and support DDR and high-bandwidth applications.
• Clock Management — Series features include digitally controlled Delay-Locked Loops (DLLs) for clock multiply/divide and duty-cycle control for DDR applications.
• Packaging and Mounting — 256-ball FBGA package (17 × 17 mm footprint) with surface-mount mounting suitable for compact board designs.
• Power and Temperature — Internal supply range 1.71 V to 1.89 V and industrial operating temperature range from −40 °C to 100 °C.
• Assembly and Compliance — Surface-mount device, RoHS compliant.

Typical Applications

• High-speed Interface Bridging — Implement protocol translators, bus bridges, and custom interface logic leveraging the device's flexible I/O and differential signalling support.
• Memory Interface and Buffering — Use the on-chip RAM and SelectRAM+ architecture to prototype or implement controllers for external memories and high-bandwidth data paths.
• Embedded System Prototyping — Reprogrammable logic and integrated clock management make the device suitable for firmware-updatable control and processing subsystems.
• Signal Processing and Arithmetic Acceleration — Implement custom arithmetic, DSP blocks, and data-path pipelines using the FPGA's logic resources and dedicated carry/multiplier support available at the series level.

Unique Advantages

• Reconfigurable Hardware — SRAM-based in-system configuration enables unlimited reprogramming for iterative development and field updates.
• Balanced Resource Set — A combination of logic elements, embedded RAM, and abundant I/O allows consolidation of glue logic, buffering, and interface functions into a single device.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• High I/O Bandwidth — Support for differential and single-ended high-speed I/O standards suitable for demanding data throughput scenarios.
• Compact Package — 256‑FBGA (17 × 17 mm) provides high pin count in a compact footprint for space-constrained board layouts.
• Standards-focused Features — Series-level support for PCI, DDR-friendly clocking, and multiple I/O standards facilitates integration into legacy and modern systems.

Why Choose XCV50E-7FG256I?

The XCV50E-7FG256I positions itself as a capable, industrial-grade Virtex‑E FPGA option that combines a practical logic element count, embedded RAM, and a high number of configurable I/Os in a compact 256‑ball BGA package. Its 1.8 V internal supply and temperature rating make it suitable for designs requiring robust operation across broad environments.

Engineers and procurement teams seeking a reprogrammable, interface-rich FPGA for medium-density designs will find this device a fit for prototyping, interface bridging, and embedded subsystem implementations, with the long-term flexibility of SRAM-based reconfiguration and ecosystem-level tool support documented at the series level.

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