XCV50E-6CS144C

IC FPGA 94 I/O 144CSBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 94 65536 1728 144-TFBGA, CSPBGA

Quantity 1,666 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-LCSBGA (12x12)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-TFBGA, CSPBGANumber of I/O94Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates71693ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV50E-6CS144C – Virtex®-E FPGA, 1728 logic elements, 94 I/O, 144-TFBGA

The XCV50E-6CS144C is a Virtex®-E series Field Programmable Gate Array (FPGA) offered in a 144‑TFBGA/CSPBGA package. This commercial-grade, surface-mount FPGA provides 1.8 V core operation with a 1.71 V to 1.89 V supply range and is designed for system-level digital integration where reprogrammability and flexible I/O are required.

With 1,728 logic elements, approximately 64 Kbits of embedded memory, and 94 user I/O pins, this device targets applications that need mid-range gate density, on-chip RAM, and a compact 144-pin BGA footprint.

Key Features

  • Logic Capacity  Contains 1,728 logic elements suitable for moderate-density digital logic and control functions.
  • On‑Chip Memory  Approximately 65,536 bits (≈64 Kbits) of embedded RAM to support local buffering, small FIFOs, and state storage.
  • I/O Density  94 user I/O pins for flexible interfacing to external peripherals, sensors, and memory devices.
  • Core Voltage  Operates at a core voltage between 1.71 V and 1.89 V, matching Virtex‑E 1.8 V family supply requirements.
  • Package and Mounting  144‑TFBGA (CSPBGA) package, supplier device package listed as 144‑LCSBGA (12×12); surface-mount for compact board-level integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Manufacturing and Compliance  RoHS compliant and 100% factory tested as part of the Virtex‑E family production specification.
  • Family-Level Capabilities  As a Virtex‑E device, it benefits from the family’s architecture which includes high-speed I/O standards support, digital clock management, and SelectRAM+ memory hierarchy (family features described in the Virtex‑E specification).

Typical Applications

  • Industrial Control  Implements mid‑density control logic, protocol bridging, and timing-critical state machines in compact, surface-mount designs.
  • Data Acquisition & Processing  Buffers and preprocesses sensor or peripheral data using on-chip RAM and programmable logic before handing off to a host processor.
  • Communications Interfaces  Provides flexible I/O and reprogrammable interface logic for custom peripheral and serial interface adaptation.

Unique Advantages

  • Reprogrammable Hardware  SRAM-based FPGA architecture allows in-system reprogramming and iterative design updates without hardware changes.
  • Compact BGA Package  144‑TFBGA (CSPBGA) package enables dense board integration while exposing 94 I/O for versatile connectivity.
  • Balanced Resource Mix  Combination of 1,728 logic elements and ~64 Kbits of RAM supports control logic plus modest buffering without external memory.
  • Family-Level Ecosystem  As part of the Virtex‑E family, the device aligns with the family’s documented tools and architectures for faster design implementation and reuse.
  • Regulatory and Manufacturing Confidence  RoHS compliance and factory-tested production help support regulatory needs and predictable supply quality.

Why Choose XCV50E-6CS144C?

The XCV50E-6CS144C is positioned for designs that require reprogrammable digital logic with a compact BGA package, a mid-range complement of logic elements, and a useful amount of on-chip RAM. Its commercial temperature rating and surface-mount 144‑TFBGA footprint make it suitable for space-constrained consumer and industrial electronics where standard commercial grading is acceptable.

Design teams seeking a device that leverages the Virtex‑E family architecture—while keeping board area and component count low—will find this device a practical choice. The combination of programmable logic, embedded RAM, and flexible I/O helps shorten system integration time and enables iterative feature development.

If you would like pricing, availability, or a formal quote for XCV50E-6CS144C, submit your request to receive a quote or contact sales for ordering and lead-time information.

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