XCV50E-6CS144C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 94 65536 1728 144-TFBGA, CSPBGA |
|---|---|
| Quantity | 1,666 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-LCSBGA (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-TFBGA, CSPBGA | Number of I/O | 94 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 71693 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV50E-6CS144C – Virtex®-E FPGA, 1728 logic elements, 94 I/O, 144-TFBGA
The XCV50E-6CS144C is a Virtex®-E series Field Programmable Gate Array (FPGA) offered in a 144‑TFBGA/CSPBGA package. This commercial-grade, surface-mount FPGA provides 1.8 V core operation with a 1.71 V to 1.89 V supply range and is designed for system-level digital integration where reprogrammability and flexible I/O are required.
With 1,728 logic elements, approximately 64 Kbits of embedded memory, and 94 user I/O pins, this device targets applications that need mid-range gate density, on-chip RAM, and a compact 144-pin BGA footprint.
Key Features
- Logic Capacity Contains 1,728 logic elements suitable for moderate-density digital logic and control functions.
- On‑Chip Memory Approximately 65,536 bits (≈64 Kbits) of embedded RAM to support local buffering, small FIFOs, and state storage.
- I/O Density 94 user I/O pins for flexible interfacing to external peripherals, sensors, and memory devices.
- Core Voltage Operates at a core voltage between 1.71 V and 1.89 V, matching Virtex‑E 1.8 V family supply requirements.
- Package and Mounting 144‑TFBGA (CSPBGA) package, supplier device package listed as 144‑LCSBGA (12×12); surface-mount for compact board-level integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial applications.
- Manufacturing and Compliance RoHS compliant and 100% factory tested as part of the Virtex‑E family production specification.
- Family-Level Capabilities As a Virtex‑E device, it benefits from the family’s architecture which includes high-speed I/O standards support, digital clock management, and SelectRAM+ memory hierarchy (family features described in the Virtex‑E specification).
Typical Applications
- Industrial Control Implements mid‑density control logic, protocol bridging, and timing-critical state machines in compact, surface-mount designs.
- Data Acquisition & Processing Buffers and preprocesses sensor or peripheral data using on-chip RAM and programmable logic before handing off to a host processor.
- Communications Interfaces Provides flexible I/O and reprogrammable interface logic for custom peripheral and serial interface adaptation.
Unique Advantages
- Reprogrammable Hardware SRAM-based FPGA architecture allows in-system reprogramming and iterative design updates without hardware changes.
- Compact BGA Package 144‑TFBGA (CSPBGA) package enables dense board integration while exposing 94 I/O for versatile connectivity.
- Balanced Resource Mix Combination of 1,728 logic elements and ~64 Kbits of RAM supports control logic plus modest buffering without external memory.
- Family-Level Ecosystem As part of the Virtex‑E family, the device aligns with the family’s documented tools and architectures for faster design implementation and reuse.
- Regulatory and Manufacturing Confidence RoHS compliance and factory-tested production help support regulatory needs and predictable supply quality.
Why Choose XCV50E-6CS144C?
The XCV50E-6CS144C is positioned for designs that require reprogrammable digital logic with a compact BGA package, a mid-range complement of logic elements, and a useful amount of on-chip RAM. Its commercial temperature rating and surface-mount 144‑TFBGA footprint make it suitable for space-constrained consumer and industrial electronics where standard commercial grading is acceptable.
Design teams seeking a device that leverages the Virtex‑E family architecture—while keeping board area and component count low—will find this device a practical choice. The combination of programmable logic, embedded RAM, and flexible I/O helps shorten system integration time and enables iterative feature development.
If you would like pricing, availability, or a formal quote for XCV50E-6CS144C, submit your request to receive a quote or contact sales for ordering and lead-time information.

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