XCV50-6FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 32768 1728 256-BGA

Quantity 166 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates57906ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XCV50-6FG256C – Virtex® Field Programmable Gate Array (FPGA) IC, 176 I/O, 32,768-bit RAM, 1,728 logic elements, 256-BGA

The XCV50-6FG256C is an SRAM-based Virtex FPGA device offering a balance of programmable logic capacity and system I/O for commercial embedded designs. The device integrates approximately 57,906 system gates and 1,728 logic elements with 32,768 bits of embedded RAM to support custom logic, high-performance interfaces and in-system reprogrammability.

Built for configurable system-level applications, the device provides multi-standard I/O, dedicated clock-management resources and on-chip memory options, making it suitable for designs requiring flexible I/O, programmable logic and iterative development cycles.

Key Features

  • Core logic — 1,728 logic elements (CLB array 16×24) and approximately 57,906 system gates provide the programmable fabric for custom digital logic and control functions.
  • Embedded memory — 32,768 total RAM bits; LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM and shift registers; configurable synchronous dual-ported 4k-bit RAMs for on-chip storage and buffering.
  • I/O and interfaces — 176 user I/Os with Multi-standard SelectIO support (16 high-performance interface standards); direct connection capability to ZBTRAM devices; 66‑MHz PCI compliance and hot-swappable support for Compact PCI.
  • Clock management — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock distribution and low-skew system timing.
  • Arithmetic and routing resources — Dedicated carry logic and multiplier support, cascade chains for wide-input functions, abundant registers/latches with clock enable and synchronous/asynchronous control, plus internal 3-state bussing.
  • Configuration and re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (including SelectMAP, serial and JTAG modes).
  • Package, power and thermal — 256-ball FBGA package (256-FBGA, 17×17), surface-mount device, supply voltage range 2.375 V to 2.625 V, commercial operating temperature 0 °C to 85 °C, RoHS compliant.
  • Process and quality — 0.22 μm, 5-layer-metal CMOS process and 100% factory-tested devices.

Typical Applications

  • PCI and Compact PCI systems — Implements custom logic and protocol bridging for 66 MHz PCI-compliant boards and hot-swappable Compact PCI modules.
  • Custom embedded systems — Provides programmable logic and on-chip memory for control, glue logic and iterative development in commercial embedded products.
  • High-speed memory interfaces — On-chip SelectRAM and fast external RAM interfaces support designs that require tight coupling to external memory.
  • Multi-standard I/O bridging — Multi-standard SelectIO and abundant I/O allow interfacing across diverse signaling standards and external devices.

Unique Advantages

  • Programmable, iterative development: SRAM-based architecture enables unlimited re-programmability for design prototyping and field updates.
  • Integrated clock control: Multiple DLLs and hierarchical clock nets simplify low-skew, multi-clock domain designs.
  • Flexible on-chip memory: Configurable LUT-based RAM and dedicated block RAM bits reduce external memory requirements for many control and buffering tasks.
  • Broad I/O adaptability: Multi-standard SelectIO and 176 user I/Os allow the device to interface with a wide range of peripherals and memory devices.
  • Commercial-grade thermal and supply specs: Defined operating range (0 °C to 85 °C) and narrow core supply range (2.375 V–2.625 V) simplify power and thermal planning for commercial products.
  • Proven manufacturing process: 0.22 μm, 5-layer-metal process and 100% factory testing provide traceable device quality for production designs.

Why Choose XCV50-6FG256C?

The XCV50-6FG256C positions itself as a versatile, commercially graded FPGA for designers needing reprogrammable logic, flexible I/O and on-chip memory in a single, surface-mount 256-FBGA package. Its combination of logic elements, embedded RAM and multi-standard I/O supports a range of system-level functions while enabling in-system updates and iterative development.

Backed by support for established FPGA development flows and configuration modes, the device is suited to engineering teams developing PCI/Compact PCI modules, custom embedded controllers and interface bridging solutions that require a programmable, reconfigurable hardware foundation.

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