XCV50E-6FG256C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 176 65536 1728 256-BGA |
|---|---|
| Quantity | 1,215 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 71693 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV50E-6FG256C – Virtex®-E Field Programmable Gate Array (FPGA), 256-BGA
The XCV50E-6FG256C is a Virtex®-E series, 1.8 V SRAM-based Field Programmable Gate Array provided in a 256-ball BGA package. It combines on-chip configurable logic and embedded RAM with flexible I/O options to address high-performance interface and custom-logic requirements.
Designed for commercial embedded applications, this device delivers 1,728 logic elements, 65,536 bits of on-chip RAM, and 176 I/O pins in a surface-mount 256-FBGA (17×17) package, with an operating range of 0 °C to 85 °C and a nominal internal supply of 1.71 V to 1.89 V.
Key Features
- Core Logic — 1,728 logic elements provide programmable fabric for implementing custom digital functions and state machines.
- Embedded Memory — 65,536 bits of on-chip RAM for FIFOs, small frame buffers, and local data storage.
- I/O Capacity — 176 I/O pins available in the 256-BGA package to support multiple external interfaces and bus connections.
- Voltage and Packaging — Operates from a 1.71 V to 1.89 V internal supply; supplied in a surface-mount 256-FBGA (17×17) package for compact board-level integration.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C for standard commercial environments.
- SRAM-Based In-System Configuration — Reprogrammable architecture enables iterative design updates and in-system reconfiguration.
- Series-Level Capabilities — Virtex-E family features cited in the product series include SelectI/O+ support for multiple interface standards, differential signalling (LVDS/LVPECL/BLVDS), built-in clock management with multiple DLLs, and dedicated carry/multiplier resources for arithmetic — applicable to designs leveraging series functionality.
- Standards & Testing — RoHS compliant and 100% factory tested as part of the product series qualification.
Typical Applications
- High-speed memory interfaces — Implement controllers and interfaces for external DDR SDRAM and ZBT SRAM using the device’s embedded memory support and series-level memory interface capabilities.
- PCI-based systems — Integrate with PCI buses and related expansion architectures leveraging the series’ PCI-compliant features.
- Protocol bridging and I/O adaptation — Use the device’s flexible I/O count and series SelectI/O+ capabilities to implement protocol conversion, serialization/deserialization, and mixed-signal interface adaptation.
Unique Advantages
- Compact integration: 1,728 logic elements and on-chip RAM in a 256-FBGA (17×17) package reduce board area and simplify layouts for space-constrained designs.
- Reprogrammability: SRAM-based in-system configuration enables iterative firmware updates and field modifications without hardware changes.
- Flexible I/O and interface support: 176 I/Os and series-level SelectI/O+ and differential signalling capabilities support a broad set of external standards and high-speed links.
- Commercial-grade reliability: Operates across a 0 °C to 85 °C range and is RoHS compliant, meeting common commercial production and environmental requirements.
- Controlled power domain: 1.71 V to 1.89 V internal supply range provides predictable power planning for system integration.
Why Choose XCV50E-6FG256C?
The XCV50E-6FG256C positions itself as a practical Virtex®-E family FPGA option for engineers who need a compact, reprogrammable logic device with solid on-chip RAM and substantial I/O capacity. Its combination of 1,728 logic elements, 65,536 bits of embedded RAM, and 176 I/Os in a 256-FBGA package supports mid-density custom logic, interface bridging, and memory-interface tasks within commercial-temperature systems.
Backed by the Virtex-E series architecture and factory testing, this device is appropriate for teams requiring iterative development, hardware reconfiguration, and reliable commercial deployment with RoHS compliance.
Request a quote or submit a procurement inquiry to begin specifying XCV50E-6FG256C for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








