XCV50E-6FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 65536 1728 256-BGA

Quantity 1,215 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells1728
Number of Gates71693ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV50E-6FG256C – Virtex®-E Field Programmable Gate Array (FPGA), 256-BGA

The XCV50E-6FG256C is a Virtex®-E series, 1.8 V SRAM-based Field Programmable Gate Array provided in a 256-ball BGA package. It combines on-chip configurable logic and embedded RAM with flexible I/O options to address high-performance interface and custom-logic requirements.

Designed for commercial embedded applications, this device delivers 1,728 logic elements, 65,536 bits of on-chip RAM, and 176 I/O pins in a surface-mount 256-FBGA (17×17) package, with an operating range of 0 °C to 85 °C and a nominal internal supply of 1.71 V to 1.89 V.

Key Features

  • Core Logic — 1,728 logic elements provide programmable fabric for implementing custom digital functions and state machines.
  • Embedded Memory — 65,536 bits of on-chip RAM for FIFOs, small frame buffers, and local data storage.
  • I/O Capacity — 176 I/O pins available in the 256-BGA package to support multiple external interfaces and bus connections.
  • Voltage and Packaging — Operates from a 1.71 V to 1.89 V internal supply; supplied in a surface-mount 256-FBGA (17×17) package for compact board-level integration.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C for standard commercial environments.
  • SRAM-Based In-System Configuration — Reprogrammable architecture enables iterative design updates and in-system reconfiguration.
  • Series-Level Capabilities — Virtex-E family features cited in the product series include SelectI/O+ support for multiple interface standards, differential signalling (LVDS/LVPECL/BLVDS), built-in clock management with multiple DLLs, and dedicated carry/multiplier resources for arithmetic — applicable to designs leveraging series functionality.
  • Standards & Testing — RoHS compliant and 100% factory tested as part of the product series qualification.

Typical Applications

  • High-speed memory interfaces — Implement controllers and interfaces for external DDR SDRAM and ZBT SRAM using the device’s embedded memory support and series-level memory interface capabilities.
  • PCI-based systems — Integrate with PCI buses and related expansion architectures leveraging the series’ PCI-compliant features.
  • Protocol bridging and I/O adaptation — Use the device’s flexible I/O count and series SelectI/O+ capabilities to implement protocol conversion, serialization/deserialization, and mixed-signal interface adaptation.

Unique Advantages

  • Compact integration: 1,728 logic elements and on-chip RAM in a 256-FBGA (17×17) package reduce board area and simplify layouts for space-constrained designs.
  • Reprogrammability: SRAM-based in-system configuration enables iterative firmware updates and field modifications without hardware changes.
  • Flexible I/O and interface support: 176 I/Os and series-level SelectI/O+ and differential signalling capabilities support a broad set of external standards and high-speed links.
  • Commercial-grade reliability: Operates across a 0 °C to 85 °C range and is RoHS compliant, meeting common commercial production and environmental requirements.
  • Controlled power domain: 1.71 V to 1.89 V internal supply range provides predictable power planning for system integration.

Why Choose XCV50E-6FG256C?

The XCV50E-6FG256C positions itself as a practical Virtex®-E family FPGA option for engineers who need a compact, reprogrammable logic device with solid on-chip RAM and substantial I/O capacity. Its combination of 1,728 logic elements, 65,536 bits of embedded RAM, and 176 I/Os in a 256-FBGA package supports mid-density custom logic, interface bridging, and memory-interface tasks within commercial-temperature systems.

Backed by the Virtex-E series architecture and factory testing, this device is appropriate for teams requiring iterative development, hardware reconfiguration, and reliable commercial deployment with RoHS compliance.

Request a quote or submit a procurement inquiry to begin specifying XCV50E-6FG256C for your next design.

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