JSR362G088NHW-AI
| Part Description |
2Gb DDR3 SDRAM, Industrial Grade, 78‑FBGA |
|---|---|
| Quantity | 909 Available (as of June 16, 2026) |
| Product Category | DRAM Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 78-BGA (7.5x11.0mm) | Memory Format | RAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 13.09 ns | Grade | Industrial | ||
| Clock Frequency | 1.066 GHz | Voltage | 1.5V | Memory Type | Volatile | ||
| Operating Temperature | -40°C - 95°C | Mounting Method | Surface Mount | Memory Interface | DDR3 SDRAM | ||
| Memory Organization | x8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | ECCN | EAR99 | HTS Code | 8542.32.00.36 |
Overview of JSR362G088NHW-AI – 2Gb DDR3 SDRAM, Industrial Grade, 78‑FBGA
The JSR362G088NHW-AI is a 2 Gbit DDR3 SDRAM device organized as 256M × 8 designed for surface-mount applications in a 78‑ball FBGA (7.5 × 11.0 mm) package. It implements DDR3 architecture with an x8 memory organization and supports industrial operating temperatures from −40 °C to +95 °C.
Engineered for high-speed synchronous memory applications, this device offers double data-rate transfers, programmable CAS/CWL timing options and on-die features that improve signal integrity and system-level timing control. It is RoHS compliant and supplied in a compact FBGA package suited to space-constrained designs.
Key Features
- Memory Core & Organization — 2 Gbit density organized as 8 banks × 32M words × 8 bits (256M × 8), with 1 KB page size for x8 configuration.
- High-Speed DDR3 Architecture — Supports data rates up to 2133 Mbps with double data-rate transfers and an 8‑bit prefetch pipelined architecture for high throughput.
- Timing & Access — Typical access time listed as 13.09 ns; CAS latencies and write latencies are programmable (CL and CWL options provided in the datasheet series).
- Burst and Addressing — Burst lengths BL = 4 and 8 (with Burst Chop), sequential and interleave burst types; row and column addressing per x8 organization (AX0–AX14, AY0–AY9).
- Signal Integrity & Interface — Bi-directional differential DQS (/DQS), differential clock inputs (CK/ /CK), DLL alignment of DQ/DQS to CK, and support for data mask (DM) for write data capture.
- On-Die Termination & Calibration — On-Die Termination (ODT) options, ZQ calibration for DQ drive and ODT, and programmable output driver impedance control for optimized signal quality.
- Power & Voltage — Designed for standard DDR3 supply; the part number variant is specified for 1.5 V operation and supports backward compatibility within the DDR3 family.
- Package & Mounting — 78‑ball FBGA (78‑FBGA) surface-mount package, supplier package dimension 7.5 × 11.0 mm for compact board-level integration.
- Industrial Temperature Range — Rated for TC = −40 °C to +95 °C providing suitability for temperature-demanding environments.
- Compliance — Lead-free and Halogen-free construction; RoHS compliant.
Typical Applications
- Industrial Control and Automation — Memory buffering and working storage in systems that require operation across −40 °C to +95 °C and reliable DDR3 interface behavior.
- Embedded Systems and Storage Controllers — High‑speed transient storage and data buffering where DDR3 throughput (up to 2133 Mbps) and compact FBGA packaging are beneficial.
- Telecommunications and Networking Equipment — Packet buffering and temporary data storage leveraging DDR3 transfer rates and programmable timing options.
Unique Advantages
- Industrial‑grade temperature tolerance — Specified −40 °C to +95 °C to support applications deployed in harsh or variable thermal environments.
- Flexible timing and performance — Programmable CAS and write latencies plus multiple data-rate grades in the series allow designers to match performance to system requirements.
- Signal integrity features built in — Differential DQS/CK, ODT modes and ZQ calibration reduce board-level tuning effort and improve data capture reliability.
- Compact FBGA packaging — 78‑ball FBGA (7.5 × 11.0 mm) minimizes PCB footprint while providing a robust surface-mount solution for dense designs.
- RoHS and lead‑free compliance — Simplifies regulatory compliance for global manufacturing and end-products.
Why Choose JSR362G088NHW-AI?
This 2 Gbit DDR3 SDRAM part provides a combination of high-speed DDR3 transfers, programmable timing flexibility and industrial temperature capability in a compact 78‑FBGA package. It suits designs that require reliable, synchronous DRAM performance with on-die termination and calibration features to ease signal integrity challenges.
Ideal for embedded, industrial and networking applications where robust thermal performance, standard DDR3 interface compatibility and a small board footprint are priorities. The device’s feature set supports designers who need scalable memory bandwidth and configurability within the DDR3 family.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for JSR362G088NHW-AI. Our team can provide technical details and ordering support to help integrate this DDR3 device into your design.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH