JSR362G088NHW-AI

2Gb DDR3 SDRAM, Industrial Grade, 78‑FBGA
Part Description

2Gb DDR3 SDRAM, Industrial Grade, 78‑FBGA

Quantity 909 Available (as of June 16, 2026)
Product CategoryDRAM Memory
ManufacturerJeju Semiconductor Corporation
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package78-BGA (7.5x11.0mm)Memory FormatRAMTechnologySDRAM - DDR3
Memory Size2 GbitAccess Time13.09 nsGradeIndustrial
Clock Frequency1.066 GHzVoltage1.5VMemory TypeVolatile
Operating Temperature-40°C - 95°CMounting MethodSurface MountMemory InterfaceDDR3 SDRAM
Memory Organizationx8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownECCNEAR99HTS Code8542.32.00.36

Overview of JSR362G088NHW-AI – 2Gb DDR3 SDRAM, Industrial Grade, 78‑FBGA

The JSR362G088NHW-AI is a 2 Gbit DDR3 SDRAM device organized as 256M × 8 designed for surface-mount applications in a 78‑ball FBGA (7.5 × 11.0 mm) package. It implements DDR3 architecture with an x8 memory organization and supports industrial operating temperatures from −40 °C to +95 °C.

Engineered for high-speed synchronous memory applications, this device offers double data-rate transfers, programmable CAS/CWL timing options and on-die features that improve signal integrity and system-level timing control. It is RoHS compliant and supplied in a compact FBGA package suited to space-constrained designs.

Key Features

  • Memory Core & Organization — 2 Gbit density organized as 8 banks × 32M words × 8 bits (256M × 8), with 1 KB page size for x8 configuration.
  • High-Speed DDR3 Architecture — Supports data rates up to 2133 Mbps with double data-rate transfers and an 8‑bit prefetch pipelined architecture for high throughput.
  • Timing & Access — Typical access time listed as 13.09 ns; CAS latencies and write latencies are programmable (CL and CWL options provided in the datasheet series).
  • Burst and Addressing — Burst lengths BL = 4 and 8 (with Burst Chop), sequential and interleave burst types; row and column addressing per x8 organization (AX0–AX14, AY0–AY9).
  • Signal Integrity & Interface — Bi-directional differential DQS (/DQS), differential clock inputs (CK/ /CK), DLL alignment of DQ/DQS to CK, and support for data mask (DM) for write data capture.
  • On-Die Termination & Calibration — On-Die Termination (ODT) options, ZQ calibration for DQ drive and ODT, and programmable output driver impedance control for optimized signal quality.
  • Power & Voltage — Designed for standard DDR3 supply; the part number variant is specified for 1.5 V operation and supports backward compatibility within the DDR3 family.
  • Package & Mounting — 78‑ball FBGA (78‑FBGA) surface-mount package, supplier package dimension 7.5 × 11.0 mm for compact board-level integration.
  • Industrial Temperature Range — Rated for TC = −40 °C to +95 °C providing suitability for temperature-demanding environments.
  • Compliance — Lead-free and Halogen-free construction; RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Memory buffering and working storage in systems that require operation across −40 °C to +95 °C and reliable DDR3 interface behavior.
  • Embedded Systems and Storage Controllers — High‑speed transient storage and data buffering where DDR3 throughput (up to 2133 Mbps) and compact FBGA packaging are beneficial.
  • Telecommunications and Networking Equipment — Packet buffering and temporary data storage leveraging DDR3 transfer rates and programmable timing options.

Unique Advantages

  • Industrial‑grade temperature tolerance — Specified −40 °C to +95 °C to support applications deployed in harsh or variable thermal environments.
  • Flexible timing and performance — Programmable CAS and write latencies plus multiple data-rate grades in the series allow designers to match performance to system requirements.
  • Signal integrity features built in — Differential DQS/CK, ODT modes and ZQ calibration reduce board-level tuning effort and improve data capture reliability.
  • Compact FBGA packaging — 78‑ball FBGA (7.5 × 11.0 mm) minimizes PCB footprint while providing a robust surface-mount solution for dense designs.
  • RoHS and lead‑free compliance — Simplifies regulatory compliance for global manufacturing and end-products.

Why Choose JSR362G088NHW-AI?

This 2 Gbit DDR3 SDRAM part provides a combination of high-speed DDR3 transfers, programmable timing flexibility and industrial temperature capability in a compact 78‑FBGA package. It suits designs that require reliable, synchronous DRAM performance with on-die termination and calibration features to ease signal integrity challenges.

Ideal for embedded, industrial and networking applications where robust thermal performance, standard DDR3 interface compatibility and a small board footprint are priorities. The device’s feature set supports designers who need scalable memory bandwidth and configurability within the DDR3 family.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for JSR362G088NHW-AI. Our team can provide technical details and ordering support to help integrate this DDR3 device into your design.

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    Date Founded: 2000


    Headquarters: Jeju-si, Jeju-do, Republic of Korea


    Employees: 100+


    Revenue: $100 Million


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