JSR362G168NHR-A

2Gb DDR3 SDRAM, 128M × 16, 96‑FBGA
Part Description

2Gb DDR3 SDRAM, 128M × 16, 96‑FBGA

Quantity 1,708 Available (as of June 16, 2026)
Product CategoryDRAM Memory
ManufacturerJeju Semiconductor Corporation
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package96-BGA (7.5x13mm)Memory FormatRAMTechnologySDRAM - DDR3
Memory Size2 GbitAccess Time13.09 nsGradeCommercial
Clock Frequency1.066 GHzVoltage1.5VMemory TypeVolatile
Operating Temperature0°C - 85°CMounting MethodSurface MountMemory InterfaceDDR3 SDRAM
Memory Organizationx16Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownECCNEAR99HTS Code8542.32.00.36

Overview of JSR362G168NHR-A – 2Gb DDR3 SDRAM, 128M × 16, 96‑FBGA

The JSR362G168NHR-A is a 2 Gbit DDR3 SDRAM device manufactured by Jeju Semiconductor in a 96‑ball FBGA (7.5 × 13 mm) surface‑mount package. It implements DDR3 SDRAM architecture with x16 organization and is specified for commercial‑grade applications.

This device delivers high‑speed, double‑data‑rate memory operation with a 1.5 V supply and support for data rates up to 2133 MT/s. It is intended for commercial electronic designs that require compact, high‑bandwidth volatile memory in a lead‑free, RoHS‑compliant package.

Key Features

  • Memory Capacity & Organization – 2 Gbit density organized as 128M × 16 bits, providing a 2 KB page size in x16 configuration.
  • High‑Speed DDR3 Interface – Supports DDR3 datapaths with data rates up to 2133 MT/s; listed timing for the -A speed grade targets 2133 MT/s with an access time of 13.09 ns.
  • Voltage & Power – Standard DDR3 1.5 V supply (VDD, VDDQ), backward compatible with DDR3 operation noted in the specification set.
  • Package & Mounting – 96‑ball FBGA (96‑BGA, 7.5 × 13 mm) surface‑mount package optimized for compact board designs.
  • Commercial Operating Range – Specified operating temperature range: 0 °C to 85 °C.
  • DDR3 Architecture Features – Eight internal banks, 8‑bit prefetch pipelined architecture, double data‑rate transfers, burst lengths 8 and 4 (with Burst Chop), and programmable CAS latency and CAS write latency options.
  • Signal Integrity & Calibration – On‑Die Termination (ODT) options, ZQ calibration for DQ drive and ODT, DLL alignment, and programmable output driver impedance control.
  • Reliability & Maintenance – Auto‑refresh and self‑refresh support, programmable partial array self‑refresh (PASR), and Multi‑Purpose Register (MPR) for predefined pattern readout.
  • Environmental Compliance – Lead‑free and RoHS compliant.

Typical Applications

  • Commercial electronic platforms – Acts as system memory where dense, high‑bandwidth volatile storage is required in space‑constrained board designs.
  • High‑bandwidth buffering – Suitable for buffering and temporary data storage where DDR3 interface and burst transfers improve throughput.
  • Embedded memory subsystems – Fits embedded designs that require standard DDR3 timing flexibility and compact FBGA packaging.

Unique Advantages

  • High effective data throughput – Supports data rates up to 2133 MT/s and a 1.5 V DDR3 interface, enabling high bandwidth in commercial systems.
  • Flexible timing options – Multiple CAS latency and CAS write latency settings allow tuning to system timing and performance requirements (CL and CWL options listed in the specification set).
  • Compact SMD footprint – 96‑FBGA (7.5 × 13 mm) package provides a small board area for dense designs without sacrificing capacity.
  • Signal quality and calibration – On‑Die Termination variants and ZQ calibration support improve signal integrity and consistent drive characteristics across assemblies.
  • Power and refresh controls – Auto‑refresh, self‑refresh, and programmable PASR reduce refresh overhead and help manage power in commercial applications.
  • Standards‑based DDR3 feature set – Implements DDR3 primitives such as DQS strobes, DLL alignment, burst modes and MPR, ensuring predictable behavior in DDR3 memory controllers.

Why Choose JSR362G168NHR-A?

The JSR362G168NHR-A positions itself as a compact, commercial‑grade DDR3 memory device that balances capacity and high‑speed operation. With 2 Gbit density, x16 organization, support for up to 2133 MT/s, and a 96‑FBGA package, it is well suited to designs that need standard DDR3 performance in a small SMD form factor while maintaining RoHS compliance.

Its configurable timing, ODT and calibration features, and standard DDR3 functionality provide designers with the flexibility to tune memory behavior for targeted performance and signal integrity needs in commercial electronic systems.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the JSR362G168NHR-A.

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    Date Founded: 2000


    Headquarters: Jeju-si, Jeju-do, Republic of Korea


    Employees: 100+


    Revenue: $100 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH


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