JSR362G168NHR-AI

2Gb DDR3 SDRAM, 96‑FBGA, Industrial
Part Description

2Gb DDR3 SDRAM, 96‑FBGA, Industrial

Quantity 1,643 Available (as of June 16, 2026)
Product CategoryDRAM Memory
ManufacturerJeju Semiconductor Corporation
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package96-BGA (7.5x13mm)Memory FormatRAMTechnologySDRAM - DDR3
Memory Size2 GbitAccess Time13.09 nsGradeIndustrial
Clock Frequency1.066 GHzVoltage1.5VMemory TypeVolatile
Operating Temperature-40°C - 95°CMounting MethodSurface MountMemory InterfaceDDR3 SDRAM
Memory Organizationx16Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownECCNEAR99HTS Code8542.32.00.36

Overview of JSR362G168NHR-AI – 2Gb DDR3 SDRAM, 96‑FBGA, Industrial

The JSR362G168NHR-AI is a 2 Gbit volatile DDR3 SDRAM device in an x16 organization targeted for industrial-grade memory applications. It implements a DDR3 double data-rate architecture with an 8‑bit prefetch pipelined core, providing a standard DDR3 interface and a robust feature set for high-speed system memory.

Designed for surface-mount integration in a compact 96‑ball FBGA (7.5 × 13 mm) package, this device offers JEDEC‑compliant DDR3 functionality, a 1.5 V supply option, and an industrial operating range down to −40 °C up to +95 °C for deployment in temperature‑sensitive environments.

Key Features

  • Memory Architecture 2 Gbit DDR3 SDRAM organized as x16 with eight internal banks and a 2 KB page size (x16), supporting flexible addressing for system memory.
  • High‑Speed Performance Series data rates up to 2133 Mbps are supported; this part lists a clock frequency of 1.066 GHz and an access time of 13.09 ns for high-throughput applications.
  • Standards and Timing JEDEC‑compliant DDR3 timing with selectable CAS latencies (CL range shown in the series) and CAS write latencies (CWL) to match system timing requirements.
  • Signal Integrity and Data Handling Features include 8‑bit prefetch, bi‑directional differential DQS/DQS¯, DLL alignment, On‑Die Termination (ODT), ZQ calibration, and support for burst lengths (BL=8,4 with Burst Chop) to improve data capture and signal quality.
  • Power and Voltage Designed for 1.5 V DDR3 operation (VDD, VDDQ), with series-level support for DDR3(L) variants and backward compatibility noted in the datasheet.
  • Package and Mounting Surface‑mount 96‑FBGA (96‑BGA, 7.5 × 13 mm) for high‑density board layouts and reliable soldered attachment.
  • Reliability and Maintenance Supported refresh modes include auto‑refresh and self‑refresh, programmable PASR (partial array self‑refresh), and Multiple Purpose Register (MPR) read patterns for diagnostics and power management.
  • Environmental Compliance Lead‑free, halogen‑free construction and RoHS compliance as indicated for the series.

Typical Applications

  • Industrial embedded systems — 2 Gbit DDR3 memory for industrial controllers and embedded platforms that require industrial temperature operation and surface‑mount memory integration.
  • DDR3‑compatible system memory — board‑level memory expansion for designs that use a standard DDR3 SDRAM interface in x16 configuration.
  • Compact PCB implementations — high‑density 96‑FBGA package suited for space‑constrained circuit boards where surface‑mount memory is required.

Unique Advantages

  • High density, compact package: 2 Gbit capacity in a 96‑FBGA (7.5 × 13 mm) minimizes board footprint while delivering significant memory capacity.
  • High throughput capability: Series support for data rates up to 2133 Mbps and a 1.066 GHz clock frequency provide bandwidth for demanding DDR3 data paths.
  • Industrial temperature range: Rated from −40 °C to +95 °C for reliable operation in thermally demanding environments.
  • Comprehensive DDR3 feature set: ODT, ZQ calibration, DLL alignment, burst modes, and MPR support enable robust signal integrity and flexible memory management.
  • Surface‑mount, board‑level readiness: 96‑ball FBGA mounting simplifies assembly for high‑density systems and standard PCB manufacturing flows.
  • Regulatory and material compliance: Lead‑free and RoHS‑compliant construction supports environmentally conscious designs.

Why Choose JSR362G168NHR-AI?

The JSR362G168NHR-AI positions itself as a practical, industrial‑grade DDR3 memory option for designs that require 2 Gbit x16 density, JEDEC‑compliant DDR3 features, and a compact 96‑FBGA footprint. Its available high data‑rate capability, combined with on‑die termination and calibration features, supports stable operation in systems that depend on reliable high‑speed memory.

This device is suitable for engineers and procurement teams seeking a surface‑mount DDR3 memory component that balances capacity, performance, and industrial temperature tolerance, while adhering to RoHS and lead‑free material requirements.

Request a quote or submit an inquiry to receive pricing, availability, and volume information for JSR362G168NHR-AI.

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    Date Founded: 2000


    Headquarters: Jeju-si, Jeju-do, Republic of Korea


    Employees: 100+


    Revenue: $100 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH


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