JSR362G168NHR-L

The JSR362G168NHR-L is a 2 Gbit DDR3L SDRAM device organized as x16 and designed for surface-mount applications. It implements double data-rate architecture with an 8-bit prefetch pipelined core to deliver high-throughput, low-latency volatile memory suitable for commercial embedded systems.

This device operates from a 1.35V supply, is RoHS compliant and supplied in a compact 96-ball FBGA (7.5 × 13 mm) package. Key measured performance parameters for this part include a clock frequency of 933 MHz and an access time of 13.91 ns.

Key Features

• Core & Memory Architecture 8-bank internal architecture with 8-bit prefetch pipelined design and double data-rate operation enabling two data transfers per clock cycle.
• Memory Organization & Density 2 Gbit density organized as 128M × 16 (x16) to provide a 2KB page size in x16 configuration.
• Performance & Timing Measured access time of 13.91 ns and support for programmable CAS latency and write latency options; burst lengths of 8 and 4 with Burst Chop.
• Power & Voltage Designed for DDR3L operation at VDD/VDDQ = 1.35V (operating range 1.283 to 1.45V) with backward compatibility to DDR3 (1.5V) operation.
• Interfaces & Signal Integrity Differential clock (CK/ /CK), bi-directional differential data strobe (DQS/ /DQS), On-Die Termination (ODT) and ZQ calibration for DQ drive and ODT control.
• Package & Mounting 96-ball FBGA surface-mount package (96-BGA, 7.5 × 13 mm) optimized for compact board designs.
• Temperature & Grade Commercial grade device with specified operating temperature from 0°C to 85°C.
• Environmental Compliance RoHS compliant; lead-free and halogen-free package options are supported.

Typical Applications

• Commercial Embedded Systems — System memory requiring 2 Gbit DDR3L in a compact 96-FBGA surface-mount package for space-constrained boards.
• Consumer Electronics — Volatile DRAM storage for commercial-grade devices where 1.35V DDR3L operation and compact packaging matter.
• Networking & Communications Equipment — High-throughput buffer memory using DDR3L interface and pipelined architecture for throughput-sensitive commercial designs.

Unique Advantages

• Low-voltage DDR3L Support — Operates at 1.35V (VDD/VDDQ) with backward compatibility to 1.5V DDR3, enabling designs that target lower system voltage rails while maintaining compatibility.
• Flexible Timing Options — Programmable CAS and CAS write latencies plus selectable burst lengths (8, 4 with BC) allow timing optimization for a variety of system needs.
• Signal Integrity Features — On-Die Termination (synchronous, dynamic and asynchronous ODT) and ZQ calibration help maintain DQ drive and termination accuracy for reliable high-speed operation.
• Compact, Surface-Mount Package — 96-FBGA (7.5 × 13 mm) package supports high-density board layouts and streamlined assembly processes.
• Regulatory & Environmental Compliance — Lead-free, halogen-free construction and RoHS compliance for commercial deployment requirements.

Why Choose JSR362G168NHR-L?

The JSR362G168NHR-L delivers a balanced combination of density, timing flexibility and compact packaging for commercial DDR3L memory applications. With a 2 Gbit x16 organization, 1.35V operation, measured 13.91 ns access time and a 933 MHz clock frequency, it is well suited to designers needing reliable volatile memory in space-constrained, surface-mount designs.

This device is aimed at teams designing commercial embedded and consumer systems that require verified DDR3L behavior, on-die termination and calibration features for improved signal integrity, and RoHS-compliant packaging for streamlined product compliance.

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