JSR362G168NHR

The JSR362G168NHR is a 2 Gbit DDR3 SDRAM device organized as x16 in a 96‑ball FBGA (7.5 × 13.3 mm) surface‑mount package. It implements DDR3 architecture with an 8‑bit prefetch pipelined data path to support high‑speed double‑data‑rate transfers.

Designed for commercial‑grade applications, the device is specified for a 1.5 V supply and an operating temperature range of 0 °C to 85 °C, providing a compact, high‑density memory option for systems that require standardized DDR3 SDRAM components.

Key Features

• Memory Core and Density 2 Gbit density organized as 128M × 16 (x16 organization) delivering 2 KB page size for x16 configuration.
• High‑Speed DDR3 Interface DDR3 SDRAM interface with double data‑rate operation and support across series data rates up to 2133 Mbps (series specification); device clock frequency listed at 933 MHz.
• Timing and Access Access time example at the 1866 MT/s grade is 13.91 ns; CAS latency and CWL options are provided across a range of supported values per the series specification.
• Power Specified supply voltage: 1.5 V (VDD/VDDQ) for this part.
• Signal Integrity and Interface Features Differential DQS (/DQS) strobe, differential clock inputs (CK/ /CK), DLL, and on‑die termination (ODT) options to support reliable high‑speed transfers.
• Reliability and Memory Management Eight internal banks, auto‑refresh and self‑refresh capabilities, ZQ calibration for drive/ODT, programmable partial array self‑refresh (PASR), and multiple ODT modes described in the series documentation.
• Package and Compliance 96‑ball FBGA (7.5 × 13.3 mm) surface‑mount package; lead‑free and halogen‑free (RoHS compliant). Commercial grade operating range: 0 °C to 85 °C.

Typical Applications

• Memory subsystem integration — Implementation as a high‑density DDR3 SDRAM component within system memory designs that require x16 2 Gb devices in a compact FBGA footprint.
• Compact board designs — Use where a 96‑FBGA package (7.5 × 13.3 mm) and surface‑mount assembly are needed to optimize PCB area and routing for DDR3 memory.
• Commercial electronics — Suitable for commercial‑grade products and designs operating within the specified 0 °C to 85 °C range that require standardized DDR3 memory behavior.

Unique Advantages

• High density in a compact package: 2 Gbit capacity in a 96‑ball FBGA (7.5 × 13.3 mm) enables significant memory without a large PCB footprint.
• Flexible performance scaling: Series supports multiple data‑rate grades up to 2133 Mbps and a range of CAS/CWL settings, allowing designers to match performance to system requirements.
• Standard DDR3 interface: Differential DQS and clock signals, DLL alignment, and ODT support enable compatibility with conventional DDR3 memory subsystems and signalling practices.
• Power and packaging readiness: Specified 1.5 V operation for this part and RoHS‑compliant, lead‑free/halogen‑free package support production and regulatory requirements for commercial designs.
• Memory management features: Built‑in refresh, self‑refresh, ZQ calibration and programmable PASR provide predictable operation and memory maintenance capabilities.

Why Choose JSR362G168NHR?

The JSR362G168NHR offers a straightforward, standards‑based DDR3 SDRAM option with 2 Gb density in an x16 organization and a compact 96‑FBGA package. Its combination of high density, standardized DDR3 interface features, and commercial temperature specification makes it suitable for designs requiring a reliable, surface‑mount DDR3 memory device.

Engineers specifying the JSR362G168NHR gain a memory component that aligns with common DDR3 timing, signal integrity, and refresh management features described in the series documentation, while maintaining a small PCB footprint and RoHS‑compliant packaging.

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