JSR362G168NHR-I

The JSR362G168NHR-I is a 2 Gbit DDR3 SDRAM memory device in a 96‑ball FBGA (96‑BGA, 7.5×13 mm) surface‑mount package. It implements DDR3 SDRAM technology with x16 organization and is specified for industrial operation.

Designed for systems that require industrial temperature range and high data‑throughput, this device provides a 933 MHz clock frequency with 13.91 ns access time and a 1.5 V power supply option. It is RoHS compliant and optimized for compact, high‑speed memory subsystems.

Key Features

• Memory Density & Organization – 2 Gbit density with x16 organization (128M × 16) providing a 2 KB page size and eight internal banks for concurrent operation.
• DDR3 SDRAM Architecture – Double data‑rate SDRAM with 8‑bit prefetch pipelined architecture, bi‑directional differential DQS, differential clock inputs and DLL for timing alignment.
• Performance – Specified clock frequency of 933 MHz and access time of 13.91 ns; series supports data rates up to 2133 Mbps and a range of CAS latencies (CL = 5–14) and CWL options.
• Power – 1.5 V supply (VDD, VDDQ); series also documents DDR3L (1.35 V) variants and backward compatibility across DDR3 voltage ranges.
• Package & Mounting – Surface‑mount 96‑FBGA (96‑BGA, 7.5×13 mm) package for compact board real estate and high‑density system integration.
• Industrial Reliability – Rated operating temperature range TC = −40 °C to +95 °C for industrial applications; supports refresh modes and ZQ calibration for drive/ODT maintenance.
• Signal Integrity & Flexibility – On‑Die Termination (synchronous/dynamic/asynchronous), programmable driver impedance, burst lengths (BL 8/4 with BC) and Multi‑Purpose Register (MPR) support.
• Compliance – Lead‑free and halogen‑free construction; RoHS compliant.

Typical Applications

• Industrial Control Systems – Industrial temperature rating and robust refresh features suit real‑time controllers and PLCs that require reliable high‑speed volatile storage.
• Networking & Telecom Equipment – High data‑rate DDR3 interface and multiple CAS/CWL options support packet buffering and frame processing in network line cards and switching equipment.
• Embedded Systems – Compact 96‑FBGA packaging and x16 organization enable space‑constrained embedded motherboards and compute modules to implement high‑capacity DRAM.
• Storage & Buffering – Low access time and support for burst transfers make the device suitable for cache/buffer memory in storage controllers and data‑streaming applications.

Unique Advantages

• Industrial Temperature Range: Rated from −40 °C to +95 °C, enabling deployment in harsh and temperature‑sensitive environments.
• High‑Speed DDR3 Interface: 933 MHz clock and series support up to 2133 Mbps provide the latency and throughput characteristics required by performance‑oriented designs.
• Compact FBGA Packaging: 96‑ball FBGA (7.5×13 mm) reduces PCB footprint while offering the pinout and density needed for modern board layouts.
• Flexible Timing & Drive Options: Wide CAS and CWL ranges plus programmable ODT and driver impedance help tune signal integrity for diverse system topologies.
• RoHS & Lead‑Free Construction: Conforms to lead‑free and halogen‑free requirements for environmentally conscious manufacturing.
• Series Feature Set: Supported features such as eight internal banks, burst chop, MPR, and ZQ calibration simplify integration in high‑performance memory designs.

Why Choose JSR362G168NHR-I?

JSR362G168NHR-I positions itself as a practical DDR3 memory building block for industrial and high‑performance embedded designs. With 2 Gbit density, x16 organization, and an industrial temperature rating, it delivers the combination of capacity, speed, and reliability needed for board‑level DRAM subsystems.

Engineers designing networking, storage buffering, or industrial control platforms will find the device’s performance characteristics, compact 96‑FBGA package, and flexible timing/ODT options helpful for optimizing throughput and signal integrity while meeting environmental and manufacturing constraints.

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