JSR362G168NHR-LI

The JSR362G168NHR-LI is a 2 Gbit DDR3L SDRAM device organized as x16 with low-voltage 1.35V operation. It implements DDR3 architecture with an 8‑bank, prefetch pipelined design to support high-speed double data‑rate transfers and JEDEC‑compliant DDR3 operation.

Targeted at industrial applications, the device combines a compact 96‑FBGA (7.5 × 13 mm) surface‑mount package with an extended operating temperature range of ‑40°C to 95°C and RoHS compliance for deployment in robust embedded systems.

Key Features

• Memory Core 2 Gbit density organized as 128M × 16 (x16) with eight internal banks for concurrent operation.
• DDR3L Architecture DDR3L SDRAM technology with double data‑rate transfers and 8‑bit prefetch pipelined architecture for high throughput.
• Performance Supports data rates up to 2133 Mbps (series specification); product data lists a clock frequency of 933 MHz and an access time of 13.91 ns for relevant speed grades.
• Low‑Voltage Power VDD/VDDQ = 1.35V (operating range 1.283 to 1.45V), enabling lower power consumption compared with standard 1.5V DDR3 operation and backward compatibility with DDR3.
• Flexible Timing Wide CAS and CWL options are supported across speed grades (CL and CWL selectable per datasheet ranges) to match system timing requirements.
• Signal Integrity & Control On‑Die Termination (ODT), programmable output driver impedance, ZQ calibration and differential DQS/CK support for reliable high‑speed signaling.
• Package & Mounting 96‑ball FBGA (7.5 × 13 mm) surface‑mount package suitable for compact PCB layouts in space‑constrained designs.
• Industrial Reliability Industrial operating temperature range of ‑40°C to +95°C and JEDEC‑compliant DDR3 functionality for consistent behavior across deployments.
• Standards & Compliance JEDEC compliant DDR3 features with RoHS (lead‑free and halogen‑free) construction.

Typical Applications

• Industrial Embedded Systems Memory subsystem for controllers and compute modules that require industrial temperature operation and compact FBGA packaging.
• Networking and Communications High‑throughput DDR3L memory for buffering and packet processing where low‑voltage operation and signal integrity features are important.
• Edge and Embedded Compute Local system memory for edge devices and embedded platforms leveraging JEDEC‑compliant DDR3 timing and multiple CAS/CWL options.

Unique Advantages

• Industrial Temperature Range: Rated for ‑40°C to +95°C, enabling deployment in harsh and outdoor environments.
• Low‑Voltage Operation (1.35V): Reduced power draw compared with standard 1.5V operation while maintaining DDR3 compatibility.
• Compact FBGA Package: 96‑ball FBGA (7.5 × 13 mm) surface‑mount package minimizes PCB footprint for space‑constrained designs.
• High Throughput Capability: Series‑level support for data rates up to 2133 Mbps and flexible timing options to match system performance targets.
• Signal Quality Controls: On‑Die Termination, ZQ calibration and programmable driver impedance help maintain signal integrity at high data rates.
• Standards Compliance and RoHS: JEDEC DDR3 compliance and lead‑free/halogen‑free construction simplify integration and regulatory planning.

Why Choose JSR362G168NHR-LI?

JSR362G168NHR-LI positions itself as a robust, industrial‑grade DDR3L memory solution delivering 2 Gbit density in an x16 organization with low‑voltage 1.35V operation. Its combination of JEDEC‑compliant DDR3 features, high‑speed capability, and signal integrity options makes it suitable for embedded and industrial designs that require reliable, compact on‑board memory.

Designers specifying this device benefit from a compact 96‑FBGA package, extended temperature range, and a set of timing and termination controls that enable predictable performance across a range of system architectures and operating conditions.

Request a quote or submit a purchase inquiry today to evaluate JSR362G168NHR-LI for your next design project.