JSR364G088NHW-A

The JSR364G088NHW-A is a 4 Gbit DDR3 SDRAM device organized as 512M × 8, designed for high-density memory applications. It implements DDR3 SDRAM architecture at a 1.5 V supply and supports DDR3-2133 timing, providing a clock period of 0.938 ns (1.066 GHz) and access timing on the order of 13.09 ns.

Targeted at commercial-grade systems, this surface-mount 78-ball FBGA package (7.5 × 11.0 mm) delivers standard DDR3 interface compatibility and RoHS-compliant manufacturing for system memory expansion and board-level integration.

Key Features

• Memory Core  4 Gbit capacity organized as 512M × 8 with 8 internal banks and fixed burst lengths (BL8) for predictable burst transfers.
• Performance  Supports DDR3-2133 timing (14-14-14) with a clock period of 0.938 ns (1.066 GHz) and typical access timing of 13.09 ns.
• Voltage  Standard DDR3 supply: VDD = VDDQ = 1.5 V as specified for the DDR3 variant.
• Interface & Timing  DDR3 SDRAM interface with differential clock inputs, programmable CAS/read and write latencies, and on-die termination options.
• Package & Mounting  78-ball FBGA package (78-FBGA) in a 7.5 × 11.0 mm footprint; surface-mount for board-level integration.
• Operating Range & Grade  Commercial grade operation with specified operating temperature from 0 °C to 85 °C.
• Regulatory  RoHS-compliant, lead-free and halogen-free package options as documented in the series data.

Typical Applications

• Embedded Systems  On‑board system memory for high-density embedded controllers and compute modules requiring DDR3-2133 performance.
• Networking Equipment  Buffer and packet memory in commercial networking devices where 4 Gbit density and standard DDR3 timing are required.
• Consumer Electronics  Memory expansion for consumer devices and multimedia platforms operating within commercial temperature ranges.

Unique Advantages

• High Density in Compact FBGA: 4 Gbit capacity in a 78-ball (7.5 × 11.0 mm) FBGA reduces board footprint while providing substantial memory capacity.
• Industry-Standard DDR3 Interface: Standard DDR3 signaling and programmable latencies simplify integration into existing DDR3 memory controllers and designs.
• Performance-Grade Timing: Support for DDR3-2133 timing with a 0.938 ns clock period enables high-throughput memory operation where required.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, suitable for a wide range of commercial applications and environments.
• RoHS Compliance: Lead-free, halogen-free packaging and manufacturing alignment for regulatory and environmental considerations.

Why Choose JSR364G088NHW-A?

The JSR364G088NHW-A combines 4 Gbit DDR3 density with DDR3-2133 timing in a compact 78-FBGA package, offering a straightforward memory upgrade path for commercial embedded, networking, and consumer designs. Its standard DDR3 interface and programmable timing options enable compatibility with established DDR3 controllers while the 1.5 V supply and RoHS-compliant packaging support common manufacturing and regulatory requirements.

This device is well suited for engineers and procurement teams seeking a validated, high-density DDR3 memory component for board-level integration where commercial operating temperature and standard DDR3 performance are priorities.

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