IM2516SDBATG-6IA

SDRAM 256MB 16MX16 166MHZ TSOPII
Part Description

SDRAM 256MB 16MX16 166MHZ TSOPII

Quantity 1,844 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntelligent Memory Ltd.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Affected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IM2516SDBATG-6IA – SDRAM 256Mbit 16M x 16 166 MHz TSOP II

The IM2516SDBATG-6IA is a 256 Mbit volatile SDRAM device organized as 16M x 16, designed for external memory applications that require standard SDRAM architecture. It delivers 166 MHz clock operation with a 5.4 ns access time, packaged in a 54-pin TSOP II footprint.

This device is suitable for designs that need a mid-density SDRAM with LVTTL interface and 3.0–3.6 V supply range, and is specified for operation across an ambient temperature range of −40°C to 85°C.

Key Features

  • Memory Core 256 Mbit SDRAM organized as 16M x 16, volatile DRAM format for external system memory.
  • Performance 166 MHz clock frequency with a typical access time of 5.4 ns to support higher-speed memory cycles.
  • Power Operates from a 3.0 V to 3.6 V supply range to match common 3 V system rails.
  • Interface LVTTL memory interface for standard signaling compatibility.
  • Package 54-pin TSOP II (0.400", 10.16 mm width) supplier device package for compact board-level integration.
  • Operating Range Specified ambient temperature range of −40°C to 85°C (TA) for a broad set of environmental conditions.

Typical Applications

  • Embedded Systems Provides external working memory for controllers and processors that require a 16M x 16 SDRAM device.
  • Consumer Electronics Used where mid-density SDRAM is needed for buffering, frame storage, or temporary data storage.
  • Industrial Equipment Fits applications that demand memory operation across a −40°C to 85°C ambient temperature range.

Unique Advantages

  • Compact TSOP II footprint: 54-pin TSOP (0.400", 10.16 mm width) package enables dense PCB layouts and efficient board-area usage.
  • Mid-density memory in standard organization: 16M x 16 organization simplifies integration into systems designed around common SDRAM configurations.
  • High-frequency operation: 166 MHz clock frequency supports faster memory access patterns compared to lower-speed SDRAM devices.
  • Low access latency: 5.4 ns access time helps reduce processor wait states and improves overall memory responsiveness.
  • Wide supply tolerance: 3.0 V to 3.6 V range accommodates a variety of 3 V system power supplies.
  • Extended ambient temperature: −40°C to 85°C rating supports deployments in varied environmental conditions.

Why Choose IM2516SDBATG-6IA?

The IM2516SDBATG-6IA combines a 256 Mbit SDRAM core with 166 MHz operation and a compact 54-pin TSOP II package, offering a practical mid-density memory option for designs that require standard 16M x 16 SDRAM. Its LVTTL interface, 3.0–3.6 V supply range, and −40°C to 85°C ambient rating make it suitable for a range of system applications where reliable external DRAM is required.

Manufactured by Intelligent Memory Ltd., this device is positioned for engineers and procurement teams seeking a verifiable specification set—clock frequency, access time, package, interface, and operating range—matched to system requirements without additional qualification claims.

Request a quote or contact sales to discuss availability, lead times, and pricing for the IM2516SDBATG-6IA.

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