IS42S16800E-6BLI-TR

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 865 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800E-6BLI-TR – IC DRAM 128MBIT PAR 54TFBGA

The IS42S16800E-6BLI-TR is a 128Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface. It implements a quad-bank, fully synchronous pipeline architecture with all signals referenced to the rising edge of the clock for high-speed, deterministic access.

This device targets embedded and industrial applications that require a compact, board-mounted SDRAM solution with programmable burst control, refresh capabilities and support for industrial temperature operation.

Key Features

  • Core & Architecture Quad-bank synchronous DRAM with pipeline architecture; all inputs and outputs are registered on the positive clock edge for predictable timing.
  • Memory Organization 128 Mbit capacity organized as 8M × 16, providing wide data paths for parallel memory designs.
  • Performance & Timing 166 MHz clock frequency (part -6 speed grade) with CAS latency options of 2 and 3 clocks and an access time of 5.4 ns (CAS latency = 3).
  • Burst Control & Sequencing Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (Sequential/Interleave) for flexible throughput tuning.
  • Refresh & Power Modes Supports Auto Refresh (CBR) and Self Refresh with 4096 refresh cycles every 64 ms for data retention and power management.
  • Interface LVTTL-compatible control signals and a parallel memory interface for integration into synchronous system designs.
  • Power Voltage supply range 3.0 V to 3.6 V (VDD/VDDQ typically 3.3 V as specified in device documentation).
  • Package & Mounting 54-ball TF‑BGA (8 × 8) package for compact board-level integration.
  • Temperature Range Industrial operating temperature range: −40 °C to +85 °C.

Typical Applications

  • Embedded Systems High-speed parallel SDRAM for buffering and working memory in embedded controllers and modules.
  • Industrial Control Suitable for industrial electronics requiring operation across −40 °C to +85 °C with synchronous, deterministic memory timing.
  • Data Buffers and Frame Stores Parallel 16-bit data organization and programmable burst modes support burst read/write buffering in data-path applications.

Unique Advantages

  • Synchronous Pipeline Architecture: Registered I/O on the rising clock edge delivers predictable timing for high-speed system designs.
  • Flexible Burst and CAS Control: Programmable burst lengths, burst sequencing and selectable CAS latency (2, 3) allow designers to tune throughput and latency.
  • Built-in Refresh Management: Auto and self refresh with 4096 cycles per 64 ms reduce system refresh overhead and support power management modes.
  • Industrial Temperature Rated: −40 °C to +85 °C operating range supports deployment in temperature-critical environments.
  • Compact TF‑BGA Package: 54-ball TF‑BGA (8×8) minimizes board footprint while enabling high-density mounting.
  • Standard 3.3 V Operation: 3.0–3.6 V supply range (typical 3.3 V) aligns with common SDRAM power rails.

Why Choose IS42S16800E-6BLI-TR?

The IS42S16800E-6BLI-TR provides a 128 Mbit, fully synchronous DRAM solution with configurable burst behavior, selectable CAS latency and built-in refresh modes—features that simplify timing control and data throughput tuning in parallel-memory systems. Its TF‑BGA footprint and industrial temperature rating make it suitable for space-constrained boards and temperature-demanding deployments.

Backed by manufacturer device documentation, this SDRAM is appropriate for designers seeking a compact, deterministic parallel memory component for embedded, industrial, and data buffering applications that require 3.3 V operation and predictable synchronous timing.

Request a quote or submit a product inquiry to obtain pricing, lead times and further purchasing information for the IS42S16800E-6BLI-TR.

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