IS42S86400F-7TLI

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 1,165 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S86400F-7TLI - 512Mbit Parallel SDRAM

The IS42S86400F-7TLI is a high-performance 512Mbit synchronous DRAM from ISSI, Integrated Silicon Solution Inc. Organized as 64M x 8, this parallel SDRAM delivers reliable memory expansion for embedded systems requiring moderate capacity and proven DRAM technology. With a 143MHz clock frequency and 5.4ns access time, it provides balanced performance for industrial, communications, and computing applications.

This device operates across an extended temperature range of -40°C to 85°C, making it well-suited for environments where ambient conditions vary beyond commercial limits. Its 3V to 3.6V supply voltage ensures compatibility with standard low-voltage logic families.

Key Features

  • 512Mbit Capacity with 64M x 8 Organization - Provides 64 megabytes of high-speed volatile storage in a straightforward parallel interface architecture that simplifies memory subsystem design.
  • 143MHz Clock Frequency with 5.4ns Access Time - Delivers synchronous operation for predictable timing and throughput in embedded processor and controller applications.
  • Parallel Interface - Uses conventional address and data bus connections that integrate directly with processors, FPGAs, and ASICs without protocol translation overhead.
  • Extended Temperature Range: -40°C to 85°C - Supports operation in industrial environments where temperature extremes are common, ensuring data integrity across varying conditions.
  • 3V to 3.6V Supply Voltage - Compatible with low-voltage designs while maintaining sufficient margin for stable operation in systems with minor supply fluctuations.
  • 54-TSOP II Package - Industry-standard surface-mount package with 0.400" (10.16mm) width facilitates PCB layout and supports automated assembly processes.

Typical Applications

  • Industrial Automation - This SDRAM provides reliable memory for PLCs, HMI systems, and industrial controllers where extended temperature tolerance ensures consistent operation in factory floor environments subject to thermal stress.
  • Embedded Computing Systems - Serves as main or expansion memory in embedded processors and microcontrollers requiring moderate capacity with synchronous timing to support real-time operating systems and application code execution.
  • Network and Communications Equipment - Acts as buffer or working memory in routers, switches, and data communications hardware where parallel interface simplifies integration and synchronous operation supports packet processing tasks.
  • Test and Measurement Instruments - Supports data acquisition and waveform capture applications where predictable access times and industrial temperature ratings contribute to instrument reliability in laboratory and field use.
  • Medical and Scientific Equipment - Provides memory expansion for diagnostic instruments and analysis systems operating in controlled but non-commercial temperature environments, with stable performance characteristics supporting repeatable measurements.

Unique Advantages

  • Simplified Parallel Interface Design: Direct connection to processor address and data buses eliminates the need for complex memory controllers or protocol conversion, reducing BOM cost and board complexity.
  • Extended Temperature Reliability: -40°C to 85°C operating range supports deployment in industrial and outdoor environments without requiring thermal management subsystems or derating.
  • Industry-Standard Footprint: 54-TSOP II package is widely supported by PCB assembly equipment and design tools, accelerating layout and simplifying supply chain qualification.
  • Proven SDRAM Architecture: Synchronous DRAM technology offers mature reliability characteristics and predictable timing behavior that support long product lifecycles and stable system operation.
  • Active Lifecycle Status: Ongoing availability reduces obsolescence risk for designs with extended production schedules and multi-year support commitments.
  • Moderate Capacity and Performance Balance: 512Mbit density and 143MHz operation address applications between lower-capacity SRAM and higher-performance DDR alternatives, optimizing cost per megabyte for mid-range requirements.

Why Choose IS42S86400F-7TLI?

The IS42S86400F-7TLI positions as a reliable choice for embedded and industrial designs requiring proven parallel SDRAM technology with extended temperature capability. Engineers developing equipment for factory automation, instrumentation, or communications infrastructure will find this device offers straightforward integration with conventional processor architectures while supporting operation in environments beyond commercial temperature limits.

For designs prioritizing supply stability and long-term availability, this active-status component from ISSI provides a dependable memory solution backed by established manufacturing and support infrastructure. Its balance of capacity, performance, and environmental tolerance makes it appropriate for applications where moderate memory requirements intersect with industrial operating conditions.

Ready to Integrate IS42S86400F-7TLI Into Your Design?

Contact our technical sales team to request a quotation, discuss volume pricing, or obtain additional technical documentation including application notes and reference designs. Our team can assist with memory subsystem architecture questions and provide guidance on integration with your specific processor or controller platform.

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