IS45S16320D-7BLA1

IC DRAM 512MBIT PAR 54TFBGA
Part Description

IC DRAM 512MBIT PAR 54TFBGA

Quantity 507 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0032

Overview of IS45S16320D-7BLA1 – 512Mbit SDRAM, 32M×16, 54‑TFBGA

The IS45S16320D-7BLA1 is a 512 Mbit synchronous DRAM organized as 32M × 16 with a parallel memory interface. It uses a pipelined, fully synchronous architecture with all signals referenced to the rising edge of the clock to support high-speed burst operations.

Designed for applications that require a compact x16 SDRAM solution, the device delivers a -7 speed grade with a 143 MHz clock frequency and a 5.4 ns access time, while supporting industrial temperature ranges and standard 54‑ball TF‑BGA packaging for space-constrained boards.

Key Features

  • Memory Core  512 Mbit SDRAM organized as 32M × 16 with internal bank architecture (4 banks) to hide row access/precharge and support pipelined operation.
  • Performance  -7 speed grade: 143 MHz maximum clock frequency and 5.4 ns access time (CAS latency options 2 or 3) for fast burst transfers.
  • Burst and Latency Control  Programmable burst length (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); burst termination via burst stop and precharge commands.
  • Refresh and Self-Management  Supports Auto Refresh (CBR), Self Refresh, and 8K refresh cycles every 64 ms to maintain data integrity.
  • Interface and Signaling  Parallel SDRAM interface with LVTTL signaling and random column addressing every clock cycle.
  • Power  Supply range 3.0 V – 3.6 V; S-series devices use VDD/VDDQ = 3.3 V.
  • Package and Mounting  54‑ball TF‑BGA (8 × 13) package optimized for compact board layouts; surface-mount TF‑BGA assembly.
  • Temperature Range  Industrial-grade operation: −40 °C to +85 °C (TA).

Typical Applications

  • High-speed buffering and frame storage  Used where synchronous, burstable parallel memory is required for temporary data storage and transfer at up to 143 MHz.
  • 16-bit data‑path memory expansion  32M × 16 organization provides a native x16 data width for systems with 16-bit memory buses.
  • Industrial systems  Operation from −40 °C to +85 °C suits embedded and industrial designs that need reliable DRAM in extended temperature environments.

Unique Advantages

  • Deterministic synchronous operation  Fully synchronous, clock-referenced signaling simplifies timing analysis and system integration with other clocked logic.
  • Flexible burst control  Programmable burst length and sequence plus CAS latency options enable tuning for throughput or latency depending on system needs.
  • Compact TF‑BGA footprint  54‑ball TF‑BGA (8×13) minimizes PCB area for high-density designs while maintaining robust solderable connections.
  • Industrial temperature support  Rated for −40 °C to +85 °C to meet environmental requirements commonly found in embedded and industrial applications.
  • Standard voltage operation  S‑series VDD/VDDQ = 3.3 V compatibility with common 3.3 V system rails simplifies power supply design.

Why Choose IS45S16320D-7BLA1?

The IS45S16320D-7BLA1 provides a compact, synchronous 512 Mbit memory solution balanced for performance and board-area efficiency. With a -7 timing grade (143 MHz) and 5.4 ns access time, programmable burst options, and robust refresh/self‑refresh features, it is well suited for designs that require predictable, high-speed parallel DRAM behavior within industrial temperature ranges.

This device is appropriate for engineers building systems that need native x16 memory organization, reliable refresh management, and a small TF‑BGA package. Its combination of timing flexibility, standard 3.3 V supply (S‑series), and industrial temperature rating offers long-term design stability for embedded and industrial memory subsystems.

Request a quote or submit a quotation request for IS45S16320D-7BLA1 to evaluate suitability for your design and obtain pricing and availability information.

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