IS45S16320D-7BLA1
| Part Description |
IC DRAM 512MBIT PAR 54TFBGA |
|---|---|
| Quantity | 507 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0032 |
Overview of IS45S16320D-7BLA1 – 512Mbit SDRAM, 32M×16, 54‑TFBGA
The IS45S16320D-7BLA1 is a 512 Mbit synchronous DRAM organized as 32M × 16 with a parallel memory interface. It uses a pipelined, fully synchronous architecture with all signals referenced to the rising edge of the clock to support high-speed burst operations.
Designed for applications that require a compact x16 SDRAM solution, the device delivers a -7 speed grade with a 143 MHz clock frequency and a 5.4 ns access time, while supporting industrial temperature ranges and standard 54‑ball TF‑BGA packaging for space-constrained boards.
Key Features
- Memory Core 512 Mbit SDRAM organized as 32M × 16 with internal bank architecture (4 banks) to hide row access/precharge and support pipelined operation.
- Performance -7 speed grade: 143 MHz maximum clock frequency and 5.4 ns access time (CAS latency options 2 or 3) for fast burst transfers.
- Burst and Latency Control Programmable burst length (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); burst termination via burst stop and precharge commands.
- Refresh and Self-Management Supports Auto Refresh (CBR), Self Refresh, and 8K refresh cycles every 64 ms to maintain data integrity.
- Interface and Signaling Parallel SDRAM interface with LVTTL signaling and random column addressing every clock cycle.
- Power Supply range 3.0 V – 3.6 V; S-series devices use VDD/VDDQ = 3.3 V.
- Package and Mounting 54‑ball TF‑BGA (8 × 13) package optimized for compact board layouts; surface-mount TF‑BGA assembly.
- Temperature Range Industrial-grade operation: −40 °C to +85 °C (TA).
Typical Applications
- High-speed buffering and frame storage Used where synchronous, burstable parallel memory is required for temporary data storage and transfer at up to 143 MHz.
- 16-bit data‑path memory expansion 32M × 16 organization provides a native x16 data width for systems with 16-bit memory buses.
- Industrial systems Operation from −40 °C to +85 °C suits embedded and industrial designs that need reliable DRAM in extended temperature environments.
Unique Advantages
- Deterministic synchronous operation Fully synchronous, clock-referenced signaling simplifies timing analysis and system integration with other clocked logic.
- Flexible burst control Programmable burst length and sequence plus CAS latency options enable tuning for throughput or latency depending on system needs.
- Compact TF‑BGA footprint 54‑ball TF‑BGA (8×13) minimizes PCB area for high-density designs while maintaining robust solderable connections.
- Industrial temperature support Rated for −40 °C to +85 °C to meet environmental requirements commonly found in embedded and industrial applications.
- Standard voltage operation S‑series VDD/VDDQ = 3.3 V compatibility with common 3.3 V system rails simplifies power supply design.
Why Choose IS45S16320D-7BLA1?
The IS45S16320D-7BLA1 provides a compact, synchronous 512 Mbit memory solution balanced for performance and board-area efficiency. With a -7 timing grade (143 MHz) and 5.4 ns access time, programmable burst options, and robust refresh/self‑refresh features, it is well suited for designs that require predictable, high-speed parallel DRAM behavior within industrial temperature ranges.
This device is appropriate for engineers building systems that need native x16 memory organization, reliable refresh management, and a small TF‑BGA package. Its combination of timing flexibility, standard 3.3 V supply (S‑series), and industrial temperature rating offers long-term design stability for embedded and industrial memory subsystems.
Request a quote or submit a quotation request for IS45S16320D-7BLA1 to evaluate suitability for your design and obtain pricing and availability information.