MT29F256G08CMCBBH2-10:B TR
| Part Description |
IC FLASH 256GBIT PAR 100TBGA |
|---|---|
| Quantity | 480 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 100 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F256G08CMCBBH2-10:B TR – IC FLASH 256GBIT PAR 100TBGA
The MT29F256G08CMCBBH2-10:B TR is a 256 Gbit non-volatile NAND flash memory device organized as 32G × 8 and implemented with MLC NAND flash technology. It provides parallel interface access with a 100 MHz clock and operates from a 2.7 V to 3.6 V supply.
This device is intended for designs that require high-density parallel flash storage in a compact 100‑TBGA (12×18) package and is specified for commercial temperature operation (0°C – 70°C, TA).
Key Features
- Memory Type & Technology MLC NAND flash non-volatile memory offering 256 Gbit capacity arranged as 32G × 8.
- Interface & Performance Parallel memory interface with a 100 MHz clock frequency for parallel-access architectures.
- Voltage Operates from a 2.7 V to 3.6 V supply to match common system power rails.
- Package Compact 100‑TBGA package (12×18) suitable for space-constrained board designs.
- Operating Temperature Commercial temperature range of 0°C – 70°C (TA).
Typical Applications
- Embedded storage systems Use as high-density non-volatile storage for firmware, file systems, or large data storage in embedded designs.
- Consumer electronics Integration into compact consumer devices that require substantial NAND capacity in a small package.
- Networking and communications equipment Storage of code and configuration data where parallel NAND access and 256 Gbit capacity are required.
Unique Advantages
- High-density single-device capacity: 256 Gbit in a single package reduces the need for multiple components to achieve large storage.
- Parallel interface with 100 MHz clock: Supports legacy and parallel-NAND controller architectures with a defined clock rate.
- Byte-wide organization (32G × 8): Simplifies controller interfacing by providing an 8-bit data bus organization.
- Wide supply voltage range: 2.7 V–3.6 V compatibility eases integration with standard system power domains.
- Space-efficient package: 100‑TBGA (12×18) delivers high capacity in a compact footprint for area-constrained PCBs.
- Commercial temperature rating: Rated for 0°C – 70°C operation for typical commercial applications.
Why Choose MT29F256G08CMCBBH2-10:B TR?
The MT29F256G08CMCBBH2-10:B TR positions itself as a straightforward solution for designers needing 256 Gbit of MLC NAND flash in a compact 100‑TBGA package with parallel interface access. Its 32G × 8 organization, 100 MHz clock specification, and 2.7 V–3.6 V supply range make it appropriate for systems that rely on parallel NAND architectures and require a high single-device capacity.
Backed by Micron Technology Inc., this device is aimed at product designs where board space, power rail compatibility, and commercial-temperature operation are primary considerations, offering a clear integration path for embedded storage, consumer devices, and networking equipment.
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