MT29F256G08CMCBBH2-10:B TR

IC FLASH 256GBIT PAR 100TBGA
Part Description

IC FLASH 256GBIT PAR 100TBGA

Quantity 480 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size256 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-TBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F256G08CMCBBH2-10:B TR – IC FLASH 256GBIT PAR 100TBGA

The MT29F256G08CMCBBH2-10:B TR is a 256 Gbit non-volatile NAND flash memory device organized as 32G × 8 and implemented with MLC NAND flash technology. It provides parallel interface access with a 100 MHz clock and operates from a 2.7 V to 3.6 V supply.

This device is intended for designs that require high-density parallel flash storage in a compact 100‑TBGA (12×18) package and is specified for commercial temperature operation (0°C – 70°C, TA).

Key Features

  • Memory Type & Technology MLC NAND flash non-volatile memory offering 256 Gbit capacity arranged as 32G × 8.
  • Interface & Performance Parallel memory interface with a 100 MHz clock frequency for parallel-access architectures.
  • Voltage Operates from a 2.7 V to 3.6 V supply to match common system power rails.
  • Package Compact 100‑TBGA package (12×18) suitable for space-constrained board designs.
  • Operating Temperature Commercial temperature range of 0°C – 70°C (TA).

Typical Applications

  • Embedded storage systems Use as high-density non-volatile storage for firmware, file systems, or large data storage in embedded designs.
  • Consumer electronics Integration into compact consumer devices that require substantial NAND capacity in a small package.
  • Networking and communications equipment Storage of code and configuration data where parallel NAND access and 256 Gbit capacity are required.

Unique Advantages

  • High-density single-device capacity: 256 Gbit in a single package reduces the need for multiple components to achieve large storage.
  • Parallel interface with 100 MHz clock: Supports legacy and parallel-NAND controller architectures with a defined clock rate.
  • Byte-wide organization (32G × 8): Simplifies controller interfacing by providing an 8-bit data bus organization.
  • Wide supply voltage range: 2.7 V–3.6 V compatibility eases integration with standard system power domains.
  • Space-efficient package: 100‑TBGA (12×18) delivers high capacity in a compact footprint for area-constrained PCBs.
  • Commercial temperature rating: Rated for 0°C – 70°C operation for typical commercial applications.

Why Choose MT29F256G08CMCBBH2-10:B TR?

The MT29F256G08CMCBBH2-10:B TR positions itself as a straightforward solution for designers needing 256 Gbit of MLC NAND flash in a compact 100‑TBGA package with parallel interface access. Its 32G × 8 organization, 100 MHz clock specification, and 2.7 V–3.6 V supply range make it appropriate for systems that rely on parallel NAND architectures and require a high single-device capacity.

Backed by Micron Technology Inc., this device is aimed at product designs where board space, power rail compatibility, and commercial-temperature operation are primary considerations, offering a clear integration path for embedded storage, consumer devices, and networking equipment.

Request a quote or submit an inquiry to check availability and pricing for the MT29F256G08CMCBBH2-10:B TR.

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