MT46V32M16BN-75 IT:C

The MT46V32M16BN-75 IT:C is a 512 Mbit volatile DRAM device implemented as DDR SDRAM with a parallel memory interface. It delivers 32M x 16 organization in a 60-ball FBGA footprint, targeting applications that require moderate-density, board-mounted DDR memory.

Key characteristics include a 133 MHz clock frequency, 750 ps access time, a 2.3 V–2.7 V supply range, and an operating temperature range of −40°C to 85°C, offering known electrical and thermal operating points for system integration.

Key Features

• Memory Core DDR SDRAM architecture with volatile memory type and a 32M x 16 organization providing 512 Mbit of storage.
• Performance & Timing Operates at a 133 MHz clock frequency with 750 ps access time and a write cycle time (word page) of 15 ns for timing-sensitive designs.
• Power Specified supply voltage range of 2.3 V to 2.7 V to match system power rails within that window.
• Package Supplied in a 60-ball FBGA package (listed as 60-TFBGA and 60-FBGA (10x12.5)) suitable for compact, surface-mounted assembly.
• Interface Parallel memory interface for direct connection to DDR-compatible memory controllers and bus architectures that accept parallel SDRAM devices.
• Operating Range Rated for ambient operating temperatures from −40°C to 85°C (TA), enabling use across common commercial and industrial thermal environments.

Typical Applications

• Embedded memory expansion — Provides 512 Mbit DDR SDRAM capacity in systems that require parallel DRAM for moderate-density storage.
• Consumer electronics — Suitable for devices needing board-mounted DDR memory where the 60-FBGA package and defined timing support are required.
• Networking and telecom equipment — Can be used in subsystems that require parallel SDRAM with defined clock and timing characteristics.
• Industrial control — The −40°C to 85°C operating range supports deployment in temperature-variable industrial environments.

Unique Advantages

• Clear electrical specification: The 2.3 V–2.7 V supply range and defined timing (133 MHz, 750 ps access, 15 ns write cycle) simplify power and timing design.
• Compact surface-mount package: The 60-FBGA (60-TFBGA / 10x12.5) footprint enables space-efficient board layouts while providing ball-grid mounting.
• Moderate-density DDR capacity: 512 Mbit (32M x 16) balances storage capacity with board-area and cost considerations for systems requiring parallel DRAM.
• Wide operating temperature: Rated from −40°C to 85°C for use in a range of commercial and industrial ambient conditions.
• Parallel interface simplicity: Direct parallel DDR interface supports conventional memory-controller connections where parallel SDRAM is required.

Why Choose MT46V32M16BN-75 IT:C?

The MT46V32M16BN-75 IT:C positions itself as a purpose-specific DDR SDRAM device combining a 512 Mbit capacity with defined timing, voltage, and temperature specifications. Its 60-ball FBGA package and parallel interface make it appropriate for designs that require board-mounted DDR memory with predictable electrical characteristics.

This device is well suited to engineers and procurement teams working on embedded systems, consumer electronics, networking/telecom modules, and industrial control applications that need a compact DDR memory option with clear operating limits and timing parameters. Its specified voltage range and temperature rating support stable long-term operation within those defined conditions.

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