MT46V64M8BN-5B:D TR

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 1,556 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (10x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level5 (48 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8BN-5B:D TR – IC DRAM 512MBIT PARALLEL 60FBGA

The MT46V64M8BN-5B:D TR is a 512 Mbit DDR SDRAM device organized as 64M × 8 with a parallel memory interface. It delivers synchronous double-data-rate operation at a 200 MHz clock frequency with an access time of 700 ps and a word-page write cycle time of 15 ns.

This device is provided in a 60-FBGA package (10 × 12.5 mm) and operates from a 2.5 V to 2.7 V supply across an ambient temperature range of 0 °C to 70 °C (TA), suitable for designs that require on-board parallel DDR memory in compact BGA form factors.

Key Features

  • Core Memory Type  DDR SDRAM architecture providing synchronous double-data-rate operation for parallel memory access.
  • Capacity & Organization  512 Mbit capacity, organized as 64M × 8, enabling byte-oriented parallel memory configurations.
  • Performance  200 MHz clock frequency and 700 ps access time deliver deterministic timing; word-page write cycle time is 15 ns.
  • Power  Operates from a 2.5 V to 2.7 V supply range to match systems designed around standard DDR I/O voltages.
  • Package & Form Factor  60-FBGA package (supplier package: 60-FBGA, 10 × 12.5 mm) for high-density board mounting in compact designs.
  • Environmental Range  Specified operating ambient temperature range of 0 °C to 70 °C (TA).

Typical Applications

  • Parallel DDR memory subsystems  Provides 512 Mbit DDR storage for designs requiring a parallel SDRAM interface and byte-wide organization.
  • On-board buffering and working memory  Used for temporary data storage where a 64M × 8 memory organization and 200 MHz operation meet system timing needs.
  • Compact BGA module designs  Suited for compact PCBs that require a 60-FBGA footprint for dense memory placement.

Unique Advantages

  • Matched DDR timing  200 MHz clock and 700 ps access time provide predictable DDR performance for synchronous memory designs.
  • Flexible voltage range  2.5 V to 2.7 V supply compatibility eases integration into systems using standard DDR operating voltages.
  • Byte-wide organization  64M × 8 configuration simplifies interfacing with parallel data buses and byte-oriented controllers.
  • Compact FBGA package  60-FBGA (10 × 12.5 mm) offers a space-efficient footprint for high-density board layouts.
  • Defined operating temperature  Specified 0 °C to 70 °C ambient range supports designs targeting commercial temperature requirements.

Why Choose IC DRAM 512MBIT PARALLEL 60FBGA?

The MT46V64M8BN-5B:D TR positions itself as a straightforward DDR SDRAM building block for systems that require a 512 Mbit parallel memory solution with clear timing and power characteristics. Its 64M × 8 organization, 200 MHz operation, and compact 60-FBGA package make it suitable for designs where board space and deterministic DDR timing are important.

This device is well suited for engineers specifying on-board parallel DRAM with a defined voltage range and commercial temperature rating, providing a predictable memory element for integration into broader system designs.

Request a quote or contact sales to discuss availability, pricing, and lead times for the MT46V64M8BN-5B:D TR.

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