MT46V64M8BN-5B:D

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 229 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (10x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level5 (48 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8BN-5B:D – 512Mbit DDR SDRAM Parallel 60‑FBGA

The MT46V64M8BN-5B:D is a 512 Mbit volatile DRAM device implemented as DDR SDRAM with a parallel memory interface and a 64M × 8 organization. It is supplied in a 60‑FBGA package and is specified for operation from 0°C to 70°C with a 2.5 V to 2.7 V supply range.

This device targets designs that require a compact, parallel DDR memory element with defined timing characteristics—supporting clock operation at 200 MHz, a 700 ps access time, and a 15 ns write cycle time (word page).

Key Features

  • Core / Memory 512 Mbit DRAM organized as 64M × 8; volatile memory for system working storage.
  • Technology DDR SDRAM architecture with a parallel memory interface supporting standard DDR signaling.
  • Performance Rated clock frequency of 200 MHz, access time of 700 ps, and write cycle time (word page) of 15 ns for deterministic timing behavior.
  • Power Operates from a 2.5 V to 2.7 V supply range, enabling compatibility with systems using this voltage domain.
  • Package 60‑TFBGA / 60‑FBGA (10 × 12.5 mm) supplier device package for board-level integration in space-constrained layouts.
  • Environmental / Temperature Range Specified operating ambient temperature range of 0°C to 70°C (TA).

Typical Applications

  • Embedded system memory — Provides 512 Mbit of volatile DDR storage for embedded controllers and processing modules requiring a parallel DDR interface.
  • Board-level memory expansion — Used as a compact DRAM component to expand working memory on single‑board computers and add‑in modules.
  • Commercial and industrial equipment — Suitable for equipment operating within the specified 0°C to 70°C ambient range and 2.5–2.7 V supply domain.

Unique Advantages

  • Defined DDR performance — 200 MHz clock rating and 700 ps access time provide clear timing parameters for system design and validation.
  • Moderate density, byte-wide organization — 64M × 8 organization simplifies interface implementation where an 8-bit data path is preferred.
  • Compact BGA footprint — 60‑FBGA (10 × 12.5 mm) package reduces board area while allowing high pin density.
  • Standard DDR parallel interface — Parallel signaling supports straightforward integration into designs requiring DDR DRAM modules.
  • Supply and temperature compatibility — Operates from 2.5 V to 2.7 V and across 0°C–70°C, matching common commercial voltage and ambient specifications.

Why Choose MT46V64M8BN-5B:D?

The MT46V64M8BN-5B:D combines a 512 Mbit DDR SDRAM architecture with defined timing (200 MHz clock, 700 ps access time, 15 ns write cycle) and a compact 60‑FBGA package to meet design needs for predictable, parallel DRAM performance. Its 64M × 8 organization and 2.5–2.7 V supply range make it suitable for systems that require an 8‑bit DDR memory element within commercial temperature limits.

This device is appropriate for designers and procurement teams specifying board-level DDR memory where clear electrical and timing specifications, compact packaging, and a 0°C–70°C operating range are required for reliable system integration.

Request a quote or contact sales to discuss availability, lead times, and pricing for the MT46V64M8BN-5B:D.

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