MT46V64M8CY-5B L:J

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 30 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of MT46V64M8CY-5B L:J – IC DRAM 512MBIT PARALLEL 60FBGA

The MT46V64M8CY-5B L:J is a 512 Mbit DDR SDRAM organized as 64M × 8 with a parallel memory interface and volatile memory operation. The device implements an internal, pipelined double-data-rate architecture that provides two data accesses per clock cycle and supports source-synchronous data capture using bidirectional DQS.

Designed for systems requiring DDR memory at a 200 MHz clock rate (speed grade -5B), the device operates from a 2.5 V to 2.7 V supply range and is offered in a 60-ball thin fine-pitch BGA package (8.0 × 12.5 mm). The device is specified for commercial temperature operation from 0°C to 70°C.

Key Features

  • Core / Architecture Internal, pipelined DDR architecture enabling two data accesses per clock cycle; includes a DLL to align DQ and DQS transitions with CK.
  • Memory Organization & Capacity 512 Mbit total capacity configured as 64M × 8 with four internal banks for concurrent operation.
  • Timing & Performance Clock frequency listed at 200 MHz (speed grade -5B) with an access time of 700 ps and a write cycle time (word page) of 15 ns. Programmable burst lengths of 2, 4, or 8 are supported.
  • Data Interface & Signals Bidirectional data strobe (DQS) transmitted/received with data for source-synchronous capture; differential clock inputs (CK and CK#); commands entered on positive CK edges. Data mask (DM) supported for write masking.
  • Power & Voltage VDD/VDDQ operation around 2.5 V (VDD = +2.5 V ±0.2 V noted in datasheet options); listed device supply range is 2.5 V to 2.7 V. 2.5 V I/O (SSTL_2 compatible) is documented.
  • Refresh & Power Management Auto refresh and specified refresh counts (8K); self-refresh options are described in the datasheet.
  • Package & Temperature 60-ball thin FBGA package (10.0 mm × 12.5 mm / listed supplier package 8 × 12.5) and commercial temperature rating of 0°C to +70°C.

Unique Advantages

  • Double-data-rate throughput: Two data accesses per clock cycle enable higher effective data rates compared with single-data-rate memories.
  • Source-synchronous DQS: Bidirectional DQS with DLL alignment improves data capture timing by aligning DQ/DQS transitions with CK.
  • Flexible burst and timing options: Programmable burst lengths (2/4/8) and documented timing grades (including -5B at 200 MHz) allow tailoring performance to system timing requirements.
  • SSTL_2-compatible I/O at 2.5 V: Standard 2.5 V I/O levels simplify interfacing with 2.5 V memory controllers and I/O subsystems.
  • Compact FBGA footprint: 60-ball FBGA (10.0 mm × 12.5 mm) provides a small board footprint for space-constrained designs.
  • Commercial temperature rating: Specified operation from 0°C to +70°C for standard commercial applications.

Why Choose IC DRAM 512MBIT PARALLEL 60FBGA?

The MT46V64M8CY-5B L:J provides a 512 Mbit DDR SDRAM building block with a pipelined DDR core, source-synchronous DQS, and programmable burst lengths—features that support high-throughput parallel memory interfaces at a 200 MHz clock rate. Its 2.5 V I/O compatibility and compact 60-ball FBGA package make it suitable for designs that require a standard DDR memory element within a constrained PCB area.

This device is appropriate for designs targeting commercial temperature ranges and needing a 64M × 8 DDR memory organization with four internal banks and documented timing grades. The combination of DDR architecture, DQS alignment, and standard 2.5 V operation provides deterministic timing characteristics useful for engineered memory subsystems.

Please request a quote or submit an RFQ to check availability, lead times, and pricing for the MT46V64M8CY-5B L:J.

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