MT46V64M8TG-75E:D TR
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 1,505 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 750 ps | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8TG-75E:D TR – IC DRAM 512Mbit Parallel 66TSOP
The MT46V64M8TG-75E:D TR is a 512 Mbit parallel DRAM device implemented as SDRAM - DDR with a 64M × 8 organization. It provides a parallel memory interface operating at a 133 MHz clock frequency, intended for use where standard DDR parallel DRAM is required.
Key electrical and mechanical characteristics include a supply voltage range of 2.3 V to 2.7 V, an access time of 750 ps, a write cycle time (word page) of 15 ns, and a 66-TSSOP package (10.16 mm width). The device is specified for an ambient operating temperature range of 0°C to 70°C.
Key Features
- Memory Core & Architecture 512 Mbit DRAM organized as 64M × 8 using SDRAM - DDR architecture for parallel memory applications.
- Performance Operates with a 133 MHz clock frequency, 750 ps access time, and a 15 ns write cycle time (word page).
- Power Supply voltage range of 2.3 V to 2.7 V, supporting system designs targeting that DDR voltage window.
- Package & Mounting 66-TSSOP (0.400", 10.16 mm width) supplier device package suitable for surface-mount PCB assembly.
- Environmental Range Rated for ambient operation from 0°C to 70°C (TA).
- Interface & Format Parallel memory interface in a DRAM format, mounting type specified as volatile memory.
Typical Applications
- Embedded memory subsystems — Acts as parallel DDR SDRAM for systems needing a 64M × 8 memory organization.
- Buffer and frame storage — Useful where 512 Mbit of volatile storage and parallel access are required.
- Legacy parallel DDR designs — Fits designs that use a 66-TSSOP footprint and operate within the 2.3 V–2.7 V supply range.
Unique Advantages
- Standard DDR SDRAM architecture: Provides a familiar 64M × 8 SDRAM - DDR organization for integration into parallel memory systems.
- Defined timing characteristics: 133 MHz clock, 750 ps access time, and 15 ns write cycle time enable predictable memory timing in system designs.
- Compact surface-mount package: 66-TSSOP (10.16 mm width) supports space-constrained PCB layouts while maintaining parallel DRAM connectivity.
- Controlled supply range: 2.3 V to 2.7 V operation aligns with standard DDR voltage requirements for compatible system power rails.
- Rated commercial temperature: 0°C to 70°C ambient rating for general-purpose electronic equipment operating in typical commercial environments.
Why Choose MT46V64M8TG-75E:D TR?
The MT46V64M8TG-75E:D TR positions itself as a straightforward 512 Mbit parallel DDR SDRAM option offering defined timing and electrical characteristics suitable for systems designed around a 64M × 8 memory organization. Its 66-TSSOP package and 2.3 V–2.7 V supply make it compatible with designs that require a compact, surface-mount parallel DRAM device with commercial temperature range operation.
This device is appropriate for engineers and procurement teams specifying parallel DDR memory for embedded systems, buffering, or legacy parallel-memory designs where the listed timing, package, and voltage characteristics meet system requirements.
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