MT46V64M8TG-75Z:D TR

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 777 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8TG-75Z:D TR – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V64M8TG-75Z:D TR is a 512 Mbit volatile DRAM device implemented as SDRAM - DDR with a parallel memory interface. It is organized as 64M × 8 and specified for operation at a 133 MHz clock frequency with an access time of 750 ps.

Offered in a 66-TSSOP (0.400", 10.16 mm width) package and supporting a 2.3 V to 2.7 V supply range, this device targets systems requiring a compact parallel DDR memory component with defined timing characteristics.

Key Features

  • Memory Type & Technology Volatile memory implemented as SDRAM - DDR, providing parallel DRAM operation in a 64M × 8 organization for a total of 512 Mbit.
  • Performance & Timing Clock frequency specified at 133 MHz with an access time of 750 ps and a write cycle time (word page) of 15 ns.
  • Voltage & Power Operates from a 2.3 V to 2.7 V supply range.
  • Package Supplied in a 66-TSSOP (0.400", 10.16 mm width) package (66-TSOP) suitable for surface-mount applications.
  • Operating Conditions Rated for an ambient operating temperature range of 0°C to 70°C (TA).
  • Interface Parallel memory interface designed for direct integration into parallel DRAM subsystems.

Typical Applications

  • Embedded Systems — Use where a 512 Mbit parallel DDR SDRAM device with defined timing and a compact 66-TSSOP package is required.
  • Memory Subsystems — Fits designs needing a 64M × 8 parallel DRAM organization operating at 133 MHz clock rates.
  • Consumer Electronics — Applicable to consumer-grade products operating within a 0°C to 70°C ambient range that require parallel DRAM memory.

Unique Advantages

  • 512 Mbit capacity: Provides a 64M × 8 memory organization for applications needing half-gigabit DRAM density.
  • DDR SDRAM technology: SDRAM - DDR architecture with a 133 MHz clock frequency and 750 ps access time for predictable timing behavior.
  • Compact package: 66-TSSOP (0.400", 10.16 mm width) package optimizes board space while supporting surface-mount assembly.
  • Defined voltage range: Operates from 2.3 V to 2.7 V, enabling designs targeted to that supply domain.
  • Specified operating temperature: Rated for 0°C to 70°C ambient operation, aligning with standard commercial-temperature designs.

Why Choose IC DRAM 512MBIT PARALLEL 66TSOP?

The MT46V64M8TG-75Z:D TR positions itself as a straightforward parallel DDR SDRAM option offering 512 Mbit density in a 64M × 8 organization. Its defined electrical and timing specifications—133 MHz clock, 750 ps access time, 15 ns write cycle time, and 2.3 V–2.7 V supply—make it appropriate for designs that require explicit timing and voltage characteristics in a compact 66-TSSOP package.

This device is suited to engineers and procurement teams specifying a fixed-density parallel DRAM component for commercial-temperature applications where package footprint, supply range, and measured timing parameters are key selection criteria.

If you need pricing, lead-time or volume-quote information for the MT46V64M8TG-75Z:D TR, request a quote or contact sales to discuss availability and ordering options.

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