MT47H32M16HR-187E:G TR

IC DRAM 512MBIT PAR 84FBGA
Part Description

IC DRAM 512MBIT PAR 84FBGA

Quantity 322 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package84-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time350 psGradeCommercial (Extended)
Clock Frequency533 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 85°C (TC)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0036

Overview of MT47H32M16HR-187E:G TR – IC DRAM 512MBIT PAR 84FBGA

The MT47H32M16HR-187E:G TR is a 512 Mbit DDR2 SDRAM organized as 32M × 16 in an 84-ball thin FBGA package. It provides parallel DRAM memory in a compact FBGA footprint and is designed for systems requiring DDR2 technology at a 533 MHz clock frequency.

With a supply voltage range of 1.7 V to 1.9 V and an operating temperature range of 0°C to 85°C, this device targets applications that require mid-density DDR2 memory with defined timing and power characteristics.

Key Features

  • Memory Core  DDR2 SDRAM technology organized as 32M × 16 for 512 Mbit total capacity.
  • Performance  Supports a clock frequency of 533 MHz with an access time of 350 ps and a write cycle time (word page) of 15 ns for timing-sensitive designs.
  • Voltage and Power  Operates from 1.7 V to 1.9 V, enabling operation within standard DDR2 supply ranges.
  • Package and Mounting  Supplied in an 84-ball thin FBGA (84-TFBGA / 84-FBGA 8×12.5) package for PCB mounting and compact system integration.
  • Interface  Parallel DRAM memory interface suitable for systems designed around DDR2 parallel memory architectures.
  • Temperature Range  Rated for operation from 0°C to 85°C (TC), supporting general commercial-temperature applications.

Typical Applications

  • Embedded memory subsystems  Use as parallel DDR2 memory where a 512 Mbit density and 32M × 16 organization meet system buffering or working memory needs.
  • Consumer electronics  Integration into devices that require compact FBGA-mounted DDR2 memory with a 0°C to 85°C operating range.
  • Communications and networking equipment  Suitable for designs that require DDR2 memory at a 533 MHz clock rate and deterministic access/write timing.

Unique Advantages

  • 512 Mbit density in a compact FBGA  Provides 512 Mbit of DDR2 storage in an 84-ball FBGA package to save board area while delivering required capacity.
  • High-frequency DDR2 support  Rated for a 533 MHz clock frequency to meet timing requirements in higher-speed DDR2 subsystems.
  • Defined timing characteristics  Access time of 350 ps and a 15 ns write cycle time (word page) support predictable memory performance.
  • Low-voltage operation  1.7 V to 1.9 V supply range aligns with DDR2 power domain designs for consistent power budgeting.
  • Commercial temperature rating  0°C to 85°C operating temperature supports a wide range of standard commercial applications.

Why Choose MT47H32M16HR-187E:G TR?

The MT47H32M16HR-187E:G TR combines DDR2 SDRAM architecture, a 512 Mbit density (32M × 16), and an 84-FBGA package to provide a compact, mid-density parallel memory option. Its 533 MHz clock rating, defined access and write timings, and 1.7 V–1.9 V supply range make it suitable for systems that require DDR2 performance and predictable timing characteristics.

This device is appropriate for designers seeking a vendor-supplied DDR2 memory component from Micron Technology Inc. for integration into embedded, consumer, or communications equipment where the specified capacity, package, voltage, and temperature range meet design requirements.

Request a quote or submit an inquiry to discuss availability, pricing, and lead time for the MT47H32M16HR-187E:G TR.

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