MT48LC2M32B2P-55:G TR

IC DRAM 64MBIT PAR 86TSOP II
Part Description

IC DRAM 64MBIT PAR 86TSOP II

Quantity 740 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5 nsGradeCommercial
Clock Frequency183 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC2M32B2P-55:G TR – IC DRAM 64MBIT PAR 86TSOP II

The MT48LC2M32B2P-55:G TR is a 64 Mbit SDR SDRAM organized as 2M × 32 with a parallel memory interface. It implements fully synchronous, pipelined SDRAM architecture with internal banks and programmable burst lengths to support system memory and board-level memory expansion.

Designed for commercial-temperature applications, this device operates from a 3.0 V to 3.6 V supply and targets systems requiring a 183 MHz clock frequency (‑55 speed grade) with fast access characteristics.

Key Features

  • Core & memory organization — 64 Mbit capacity arranged as 2M × 32 (512K × 32 × 4 banks) for multi-bank operation and concurrent access management.
  • Synchronous SDRAM architecture — Fully synchronous operation with all signals registered on the positive clock edge and internal pipelined operation to allow column address changes every clock cycle.
  • Performance & timing — Specified for a 183 MHz clock frequency (‑55 speed grade) with an access time listed as 5 ns and CAS latency (CL) support of 1, 2 and 3.
  • Programmable burst and refresh — Supports programmable burst lengths (1, 2, 4, 8 or full page), auto precharge, auto refresh and self refresh modes; 4096-cycle refresh available per datasheet.
  • Voltage and I/O — Single 3.3 V ±0.3 V supply (3.0 V–3.6 V) with LVTTL-compatible inputs and outputs.
  • Package & thermal — Available in an 86‑pin TSOP II (400 mil, 10.16 mm width) package; commercial operating temperature 0°C to +70°C.

Typical Applications

  • Embedded systems — Provides parallel SDRAM storage for board-level memory in commercial-temperature embedded designs that require a 3.3 V supply and standard TSOP II footprint.
  • System memory expansion — Used where a 2M × 32 SDRAM organized in four banks is required for buffering and working memory with programmable burst lengths and pipelined access.
  • PC/legacy platforms — PC100‑compliant SDRAM timing options make this device suitable for legacy or existing systems expecting standard SDR SDRAM timing and interfaces.

Unique Advantages

  • Synchronous pipelined operation: Internal pipelining and bank architecture enable efficient column access every clock cycle, reducing wait states in burst operations.
  • Flexible burst control: Programmable burst lengths (1, 2, 4, 8, full page) allow designers to match data-transfer patterns and optimize throughput.
  • Standard voltage domain: Single 3.3 V ±0.3 V supply simplifies power budgeting and compatibility with common 3.3 V logic domains.
  • Multiple CAS latency support: CL = 1, 2, 3 options permit trade-offs between latency and system timing requirements.
  • Industry-standard package: 86‑pin TSOP II footprint supports compact board-level implementation and established assembly processes.
  • Refresh and power modes: Auto refresh and self-refresh options aid data retention and control of power/refresh management in system designs.

Why Choose MT48LC2M32B2P-55:G TR?

The MT48LC2M32B2P-55:G TR offers a straightforward, standards-based SDR SDRAM solution with a 64 Mbit capacity, 2M × 32 organization and four internal banks. Its synchronous, pipelined design and programmable burst capabilities make it suitable for designers who need predictable timing, parallel interface compatibility and a compact 86‑pin TSOP II package.

This device is positioned for commercial-temperature boards and systems that require a 3.3 V supply and PC100-style SDRAM timing. Choosing this Micron SDRAM provides a verified memory building block for products requiring parallel SDRAM with flexible timing and refresh modes.

Request a quote or submit an inquiry to sales for pricing, lead times and availability for the MT48LC2M32B2P-55:G TR.

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