MT48LC4M16A2TG-75 IT:G TR

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 312 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M16A2TG-75 IT:G TR – IC DRAM 64MBIT PAR 54TSOP II

The MT48LC4M16A2TG-75 IT:G TR is a 64 Mbit synchronous DRAM device configured as 4M x 16 with 4 internal banks. It implements a fully synchronous, parallel SDRAM architecture with support for programmable burst lengths, internal pipelined operation, and standard auto-refresh/self-refresh modes.

This industrial-temperature SDRAM is targeted at systems requiring a compact 54‑pin TSOP II package, 3.3 V operation, and PC‑class SDRAM timing (PC66/PC100/PC133 compatibility). It is suited for embedded and industrial designs that need a parallel SDRAM memory interface with hardware-managed refresh and low-power options.

Key Features

  • Core / Memory Organization 64 Mbit SDRAM organized as 4M x 16 with 4 internal banks, providing standard SDRAM row/column bank architecture for pipelined operation.
  • Performance PC66-, PC100-, and PC133-compliant timing with a 133 MHz clock frequency and an access time of 5.4 ns; supports programmable burst lengths (1, 2, 4, 8, or full page).
  • System Features Fully synchronous operation with all signals registered on the positive clock edge, internal pipelined operation, internal banks to hide row access/precharge, Auto Precharge (including concurrent Auto Precharge) and Auto Refresh modes.
  • Power and Refresh Single +3.3 V supply (3.0 V to 3.6 V) with standard and low-power self-refresh modes; 64 ms, 4,096-cycle refresh supported for data retention.
  • Interface and I/Os Parallel memory interface with LVTTL-compatible inputs and outputs; write-cycle time (word/page) specified at 15 ns.
  • Package and Temperature 54‑pin TSOP II package (0.400", 10.16 mm width) and industrial operating temperature range of −40 °C to +85 °C.

Typical Applications

  • PC and legacy systems Supports PC66/PC100/PC133 timing for integration into platforms that require standard SDRAM timing compatibility.
  • Industrial embedded equipment Industrial temperature range (−40 °C to +85 °C) and 3.3 V supply make it suitable for embedded controllers and instrumentation operating in harsh environments.
  • Compact memory modules 54‑pin TSOP II package enables space-constrained board-level memory implementations where a 64 Mbit SDRAM is required.

Unique Advantages

  • Standard SDRAM timing compliance: PC66/PC100/PC133 compatibility simplifies integration with systems designed for these timing classes.
  • Industrial temperature rating: Operates from −40 °C to +85 °C, allowing deployment in temperature-challenging environments.
  • Single 3.3 V supply: 3.0 V–3.6 V supply range aligns with common system rails for simplified power design.
  • Compact TSOP II package: 54‑pin 0.400" TSOP II footprint supports high-density board layouts.
  • Power-management modes: Standard and low-power self-refresh options reduce power during idle periods and maintain data integrity.
  • Hardware-managed refresh and pipelining: Internal banks, auto-refresh, and pipelined operation reduce controller complexity and improve effective throughput.

Why Choose MT48LC4M16A2TG-75 IT:G TR?

The MT48LC4M16A2TG-75 IT:G TR provides a compact, industrial-temperature SDRAM solution with PC-class timing, a parallel LVTTL I/O interface, and built-in refresh and low-power modes. Its 4M x 16 organization and TSOP II package make it suitable for embedded and industrial designs needing a reliable 64 Mbit volatile memory in a small form factor.

This device is appropriate for designers who need predictable SDRAM behavior, straightforward integration with 3.3 V systems, and thermal performance across −40 °C to +85 °C. The combination of pipelined internal operation, programmable burst lengths, and self-refresh support offers scalable performance and power-management options for long-term deployments.

Request a quote or contact sales to discuss availability, lead times, and pricing for MT48LC4M16A2TG-75 IT:G TR.

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