MT48LC4M16A2TG-7E IT:G
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 16 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M16A2TG-7E IT:G – IC DRAM 64Mbit Parallel 54‑TSOP II
The MT48LC4M16A2TG-7E IT:G is a 64 Mbit synchronous DRAM organized as 4M × 16 with four internal banks and a parallel memory interface. Designed for synchronous operation at PC133 timing, it provides a compact 54-pin TSOP II footprint and supports industrial temperature operation.
Typical use cases include systems that require parallel SDRAM memory with programmable burst operation, predictable timing, and a standard +3.3 V power domain.
Key Features
- Core / Architecture Fully synchronous SDRAM with internal pipelined operation and four internal banks to hide row access and precharge latency.
- Memory Organization 64 Mbit capacity arranged as 4M × 16 with 4 banks (1M × 16 × 4 banks).
- Performance PC66, PC100 and PC133-compliant timing; supports up to 133 MHz system clock and an access time specification listed as 5.4 ns.
- Programmability Programmable burst lengths (1, 2, 4, 8, or full-page) and Auto Precharge, Concurrent Auto Precharge, Auto Refresh, and Self-Refresh modes.
- Power Single +3.3 V ±0.3 V supply (specified 3.0 V to 3.6 V) with standard and low-power self-refresh options.
- Timing Internal column address can be changed every clock cycle; write recovery and timing options indicated in device marking (e.g., -7E timing option).
- Package & Mounting 54-pin TSOP II (0.400", 10.16 mm width) plastic package for surface-mount applications.
- Temperature Range Industrial operating temperature range of −40 °C to +85 °C (TA).
Typical Applications
- PC and legacy system memory Use where PC66/PC100/PC133 timing compatibility and parallel SDRAM interface are required.
- Embedded systems with parallel SDRAM Provides a compact, industrial-temperature SDRAM option for embedded controllers and memory subsystems.
- Buffering and frame memory Programmable burst lengths and internal banks support burst-oriented buffering and frame storage in systems using a parallel memory bus.
Unique Advantages
- Industry-standard timing support: PC66/PC100/PC133 compliance permits integration into systems designed for those SDRAM timing classes.
- Flexible burst and refresh modes: Programmable burst lengths plus Auto Precharge and Self-Refresh modes provide flexibility for varied memory access patterns and power conditions.
- Industrial temperature rating: −40 °C to +85 °C operation expands usage to environments with wider temperature variation.
- Compact TSOP II package: The 54-pin 0.400" TSOP II package enables dense board integration while preserving a parallel interface.
- Standard 3.3 V supply: Operates from a single +3.3 V ±0.3 V rail (3.0 V–3.6 V), matching common system power domains.
Why Choose MT48LC4M16A2TG-7E IT:G?
The MT48LC4M16A2TG-7E IT:G positions itself as a synchronous parallel DRAM solution that combines PC-class timing compatibility, programmable burst operation, and industrial temperature capability in a small 54-pin TSOP II package. Its 4M × 16 organization with four internal banks and standard +3.3 V power make it suitable for designs that require predictable SDRAM timing and straightforward board-level integration.
Designers targeting systems that need parallel SDRAM memory at PC133-class clocking or require industrial temperature support can leverage this device for reliable memory capacity, refresh and self-refresh options, and a compact surface-mount footprint.
Request a quote or contact sales to discuss availability, pricing, and delivery for the MT48LC4M16A2TG-7E IT:G.