MT48LC4M32B2B5-6:G
| Part Description |
IC DRAM 128MBIT PAR 90VFBGA |
|---|---|
| Quantity | 819 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-VFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.5 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M32B2B5-6:G – IC DRAM 128MBIT PAR 90VFBGA
The MT48LC4M32B2B5-6:G is a 128 Mbit parallel DRAM device implemented as SDRAM with a 4M × 32 organization. Packaged in a 90-pin VFBGA (8×13) footprint, it provides synchronous dynamic memory storage for designs that require a parallel SDRAM interface.
This device targets designs that need 128 Mbit of volatile SDRAM operating at a clock frequency of 167 MHz, supporting standard timing characteristics and an operating ambient temperature range of 0°C to 70°C.
Key Features
- Memory Type & Technology Volatile SDRAM technology providing synchronous dynamic memory behavior suitable for temporary data storage and working memory functions.
- Organization & Capacity 4M × 32 memory organization delivering a total memory size of 128 Mbit in a single device.
- Performance 167 MHz clock frequency with an access time of 5.5 ns and a write cycle time (word/page) of 12 ns, enabling predictable synchronous access timing.
- Voltage & Power Operates from a 3.0 V to 3.6 V supply range.
- Package 90‑VFBGA (8×13) supplier device package that consolidates 128 Mbit SDRAM into a compact ball grid array footprint.
- Operating Temperature Specified for ambient operation from 0°C to 70°C (TA).
- Interface Parallel memory interface consistent with the 4M × 32 organization for integration with parallel SDRAM controllers.
Typical Applications
- Embedded Systems — Provides 128 Mbit of volatile SDRAM for embedded designs requiring parallel synchronous memory for runtime data and program working storage.
- Digital Buffering — Suited for buffering and temporary data storage in systems that use a parallel SDRAM interface and require predictable access timing.
- FPGA/ASIC Memory Expansion — Can be used to add parallel SDRAM capacity where a 32‑bit wide memory organization is required.
- Consumer Electronics — Applicable in electronic products that operate within the specified 0°C to 70°C ambient temperature and 3.0 V–3.6 V supply range.
Unique Advantages
- Parallel 32‑bit Organization: The 4M × 32 arrangement provides a full 32‑bit data path, enabling straightforward integration with 32‑bit parallel memory controllers.
- Synchronous Timing Characteristics: 167 MHz clock rate with 5.5 ns access time and 12 ns write cycle time offers defined synchronous performance for predictable memory cycles.
- Compact BGA Package: The 90‑VFBGA (8×13) form factor delivers 128 Mbit capacity in a compact footprint for space-constrained board designs.
- Standard Voltage Range: 3.0 V to 3.6 V supply compatibility aligns with common system power rails.
- Specified Ambient Range: Rated for operation from 0°C to 70°C, suitable for many commercial temperature applications.
Why Choose MT48LC4M32B2B5-6:G?
The MT48LC4M32B2B5-6:G positions itself as a straightforward parallel SDRAM option delivering 128 Mbit of volatile memory in a 4M × 32 organization. Its synchronous operation at up to 167 MHz, defined access and write timing, and compact 90‑VFBGA package make it suitable for designs that require predictable parallel memory performance and a small board footprint.
This device is appropriate for designers seeking a clear specification set—memory size, clock frequency, timing, voltage range, and ambient temperature—allowing for deterministic integration into systems requiring parallel SDRAM capacity.
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