MT48LC8M16A2TG-7E IT:G TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 756 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC8M16A2TG-7E IT:G TR – IC DRAM 128MBIT PAR 54TSOP II
The MT48LC8M16A2TG-7E IT:G TR is a 128 Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with four internal banks and a parallel memory interface. It implements fully synchronous, pipelined operation with programmable burst lengths and LVTTL-compatible I/O, targeting designs that require commodity parallel SDRAM memory in a 54-pin TSOP II package.
With a single 3.3 V ±0.3 V supply range (3.0 V–3.6 V), PC100/PC133 timing options and an industrial operating temperature range (–40 °C to +85 °C), this device is intended for systems that need standard SDRAM functionality with industrial temperature capability.
Key Features
- Core Architecture — 128 Mbit SDRAM organized as 8M × 16 with four internal banks to enable concurrent row access and precharge hiding.
- Synchronous, Pipelined Operation — Fully synchronous design with all signals registered on the positive clock edge and internal pipelining; column address can be changed every clock cycle.
- Timing and Performance — PC100/PC133-compliant options; specified clock frequency up to 133 MHz and access timing data consistent with the -7E speed grade.
- Programmable Burst and Refresh — Programmable burst lengths of 1, 2, 4, 8, or full page; supports auto refresh and a 64 ms / 4096-cycle refresh interval for commercial and industrial operation.
- Low-power and Auto Modes — Auto precharge, concurrent auto precharge and auto refresh modes, and self-refresh capability (standard and low-power options noted in datasheet options).
- Electrical — Single-supply operation at 3.0 V–3.6 V (3.3 V ±0.3 V) with LVTTL-compatible inputs and outputs.
- Package and Mounting — 54-pin TSOP II (0.400", 10.16 mm width) plastic package suitable for surface-mount assembly.
- Temperature Range — Industrial ambient rating: –40 °C to +85 °C (TA).
Typical Applications
- Embedded Systems — Provides parallel SDRAM storage for embedded controllers and processing boards that require synchronous burst access and standard SDRAM interface.
- Industrial Control — Industrial temperature range and standard SDRAM timing make it suitable for control and automation equipment operating across wide temperatures.
- Memory Expansion Modules — Used in memory module designs or boards that need 128 Mbit parallel SDRAM in a compact 54-TSOP II footprint.
Unique Advantages
- Standard SDRAM Feature Set: Fully synchronous, pipelined operation with programmable burst lengths and auto refresh simplifies integration into standard SDRAM controllers.
- Industrial Temperature Capability: Rated for –40 °C to +85 °C operation, enabling deployment in temperature-demanding environments.
- Compact Surface-Mount Package: 54-pin TSOP II (400 mil / 10.16 mm width) provides a low-profile surface-mount option for space-constrained boards.
- Compatible Timing Options: PC100/PC133 timing compliance supports common system clock domains up to 133 MHz (-7E speed grade).
- Robust Refresh and Power Modes: Auto refresh, auto precharge and self-refresh modes help manage data integrity and power in typical SDRAM use cases.
Why Choose MT48LC8M16A2TG-7E IT:G TR?
The MT48LC8M16A2TG-7E IT:G TR offers a conventional, industry-proven SDRAM architecture that balances standard timing compatibility, programmable burst operation and industrial temperature support. Its 8M × 16 organization with four internal banks and LVTTL I/O provides predictable integration for designs that use parallel SDRAM memory.
This device is suited for engineers and procurement teams specifying a 128 Mbit SDRAM in a compact TSOP II package where standard PC100/PC133 timing, a 3.3 V class supply and industrial ambient range are required. The combination of synchronous pipelined operation, refresh modes and package density supports stable, maintainable memory implementations across a range of embedded and industrial applications.
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