MT53D1024M32D4DT-046 AUT:D TR

IC DRAM 32GBIT 2.133GHZ 200VFBGA
Part Description

IC DRAM 32GBIT 2.133GHZ 200VFBGA

Quantity 1,401 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package200-VFBGA (10x14.5)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size32 GbitAccess TimeN/AGradeAutomotive
Clock Frequency2.133 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-40°C ~ 125°C (TC)Write Cycle Time Word PageN/APackaging200-VFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 32
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.0036

Overview of MT53D1024M32D4DT-046 AUT:D TR – 32 Gbit LPDDR4 SDRAM, 2.133 GHz, 200-VFBGA

The MT53D1024M32D4DT-046 AUT:D TR is a 32 Gbit volatile DRAM device implemented in Mobile LPDDR4 SDRAM technology. It provides a 1G x 32 memory organization with a 2.133 GHz clock frequency and operates from a 1.1 V supply.

This device targets high-density, high-speed memory requirements and is offered in a 200-ball very fine pitch BGA (10 × 14.5 mm) package. It carries AEC-Q100 qualification and an operating temperature range of -40°C to 125°C.

Key Features

  • Core / Memory Architecture Mobile LPDDR4 SDRAM technology with a memory organization of 1G × 32 and a total memory size of 32 Gbit.
  • High-Speed Operation Specified clock frequency of 2.133 GHz for high-throughput memory access.
  • Power Operates from a 1.1 V supply voltage as specified for LPDDR4 operation.
  • Package Supplied in a 200-VFBGA package (10 × 14.5 mm) suitable for surface-mount assembly.
  • Temperature & Qualification Qualified to AEC-Q100 with an operating temperature range of -40°C to 125°C (TC), supporting deployment in demanding thermal environments.
  • Memory Format Volatile DRAM suitable for high-density system memory applications.

Typical Applications

  • Automotive systems AEC-Q100 qualification and wide temperature range make the device suitable for in-vehicle electronic systems requiring high-density, high-speed memory.
  • Mobile and embedded devices Mobile LPDDR4 architecture and 1.1 V operation address compact, energy-conscious embedded memory designs.
  • High-density memory modules 32 Gbit capacity in a 200-VFBGA package supports designs where board area and memory density are primary considerations.

Unique Advantages

  • High memory density: 32 Gbit capacity delivered in a compact 200-VFBGA (10 × 14.5 mm) package reduces system board area for high-density designs.
  • High-speed throughput: 2.133 GHz clock frequency enables faster memory transactions for bandwidth-sensitive applications.
  • Automotive qualification: AEC-Q100 qualification provides a documented level of reliability suitable for automotive-grade applications.
  • Wide operating temperature: Rated from -40°C to 125°C (TC), enabling operation across extended temperature ranges.
  • LPDDR4 power profile: 1.1 V supply aligns with LPDDR4 mobile power requirements for integration into low-voltage system architectures.

Why Choose MT53D1024M32D4DT-046 AUT:D TR?

The MT53D1024M32D4DT-046 AUT:D TR positions itself as a high-density, high-speed LPDDR4 memory component with explicit automotive qualification and an extended temperature range. Its combination of 32 Gbit capacity, 2.133 GHz operation, and 1.1 V supply makes it suitable for designs that require compact, high-throughput volatile memory.

This device is suited to engineering teams and procurement teams specifying automotive-grade or mobile LPDDR4 memory where long-term reliability, thermal range, and board-area efficiency are priorities.

Request a quote or contact sales for pricing, availability, and lead-time information for the MT53D1024M32D4DT-046 AUT:D TR.

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