MT53D1024M32D4DT-046 AUT:D

IC DRAM 32GBIT 2.133GHZ 200VFBGA
Part Description

IC DRAM 32GBIT 2.133GHZ 200VFBGA

Quantity 490 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package200-VFBGA (10x14.5)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size32 GbitAccess TimeN/AGradeAutomotive
Clock Frequency2.133 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-40°C ~ 125°C (TC)Write Cycle Time Word PageN/APackaging200-VFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 32
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.0036

Overview of MT53D1024M32D4DT-046 AUT:D – IC DRAM 32GBIT 2.133GHZ 200VFBGA

The MT53D1024M32D4DT-046 AUT:D is a volatile DRAM device built on Mobile LPDDR4 technology with a memory density of 32 Gbit organized as 1G × 32. It operates at a clock frequency of 2.133 GHz and runs from a 1.1 V supply.

Designed and manufactured by Micron Technology Inc., this device targets systems requiring high-density, high-speed LPDDR4 memory in a compact 200-VFBGA package, and it includes AEC-Q100 qualification with an operating temperature range of -40°C to 125°C (TC).

Key Features

  • Core / Memory: Mobile LPDDR4 SDRAM technology; 32 Gbit capacity organized as 1G × 32 and formatted as DRAM.
  • Performance: Rated clock frequency of 2.133 GHz for high-speed memory operation.
  • Power: Low-voltage operation with a 1.1 V supply to support power-sensitive designs.
  • Package: 200-VFBGA package (supplier package: 200-VFBGA, 10 × 14.5 mm) for compact board integration.
  • Temperature and Qualification: AEC-Q100 qualification and an operating temperature range of -40°C to 125°C (TC) for demanding thermal environments.
  • Mounting / Format: Volatile DRAM in a ball grid array package suitable for surface-mount assembly.

Typical Applications

  • Automotive systems: AEC-Q100 qualification and wide temperature range make this device suitable for automotive electronic modules requiring LPDDR4 memory.
  • Mobile platforms: Mobile LPDDR4 technology and 2.133 GHz clocking address high-speed memory requirements in mobile-class architectures.
  • Embedded and industrial electronics: The -40°C to 125°C temperature range supports embedded controllers and industrial modules operating in harsh environments.

Unique Advantages

  • Automotive-qualified component: AEC-Q100 qualification provides traceable automotive-level qualification for designs that require it.
  • High-density memory: 32 Gbit capacity (1G × 32) enables higher memory integration in a single device.
  • High-speed operation: 2.133 GHz clock frequency supports demanding data-rate requirements inherent to LPDDR4 designs.
  • Low-voltage operation: 1.1 V supply reduces power draw compared with higher-voltage alternatives.
  • Compact VFBGA package: 200-VFBGA (10 × 14.5 mm) package minimizes board footprint while supporting surface-mount assembly.
  • Wide operating temperature: -40°C to 125°C (TC) supports use in thermal-stressed and industrial environments.

Why Choose MT53D1024M32D4DT-046 AUT:D?

The MT53D1024M32D4DT-046 AUT:D combines mobile LPDDR4 architecture, 32 Gbit density, and 2.133 GHz operation in a compact 200-VFBGA footprint, providing a clear specification set for designs that require high-speed volatile memory. Its 1.1 V supply and AEC-Q100 qualification, along with a -40°C to 125°C operating range, position it for applications that need both performance and thermal robustness.

Backed by Micron Technology Inc., this device is suited for engineers and procurement teams seeking a qualified LPDDR4 DRAM component for automotive, mobile, and embedded applications where verified temperature range and a compact package are important design considerations.

If you need pricing, availability, or a formal quote for MT53D1024M32D4DT-046 AUT:D, please request a quote or contact sales to discuss your requirements and lead times.

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