NAND512W3A2BZA6E

IC FLASH 512MBIT PAR 63VFBGA
Part Description

IC FLASH 512MBIT PAR 63VFBGA

Quantity 668 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerSTMicroelectronics
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package63-VFBGA (8.5x15)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging63-VFBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND512W3A2BZA6E – IC FLASH 512MBIT PAR 63VFBGA

The NAND512W3A2BZA6E is a 512 Mbit non-volatile NAND flash memory organized as 64M x 8, supplied in a 63-VFBGA package (8.5 × 15 mm). It implements a parallel NAND interface and is targeted for mass storage applications and embedded systems requiring dense, low-voltage flash memory.

Designed for system boot and data storage, the device offers fast sequential access and standard NAND features such as copy-back programming and automatic page 0 read at power-up to support system boot workflows.

Key Features

  • Memory Core  512 Mbit NAND flash organized as 64M × 8 with x8 bus width; page size for x8 devices is 512 bytes plus 16 spare bytes.
  • Interface  Parallel NAND interface with multiplexed address/data pins and pinout compatibility across densities for straightforward board integration.
  • Performance  Sequential access down to 50 ns (min) and random page read typical/max values documented; page program time typical 200 µs and write-cycle timing supports 50 ns word/page cycles.
  • Power  3.0 V device supply range: 2.7 V to 3.6 V for compatibility with common system rails.
  • Package  63-VFBGA package, 8.5 × 15 mm footprint, suitable for compact board layouts.
  • Reliability & Data Integrity  Designed for 100,000 program/erase cycles and 10 years data retention; includes hardware data protection (program/erase locked during power transitions) and a status register for operation monitoring.
  • System Features  Copy-back program mode for fast internal page-to-page transfer, fast block erase (typical 2 ms), electronic signature, serial number option and automatic page 0 read at power-up for boot support.
  • Development Support  Datasheet notes availability of ECC models, bad block management and wear-leveling algorithms, demo hardware and reference software to assist integration and validation.
  • Operating Range  Specified operating ambient temperature range of −40 °C to 85 °C (TA) for a wide range of environments.

Typical Applications

  • Mass storage devices  Dense NAND array and spare-area architecture provide cost-effective storage for consumer and embedded mass-storage applications.
  • Embedded system boot memory  Automatic page 0 read at power-up option enables boot-from-NAND scenarios for embedded platforms.
  • File-system and data logging  512 Mbit capacity with spare area supports file-system structures and wear management for data logging applications.

Unique Advantages

  • High-density storage: 512 Mbit in a compact VFBGA package reduces board area while providing significant non-volatile capacity.
  • Parallel NAND interface: x8 bus and multiplexed address/data reduce external buffering requirements and simplify host interface design.
  • Boot support built-in: Automatic page 0 read at power-up facilitates system boot without additional boot ROM.
  • Robust endurance and retention: 100,000 program/erase cycles and 10 years data retention support long-term field operation and data integrity.
  • Design & validation resources: ECC models, wear-leveling and bad-block management algorithms, plus demo hardware and reference software streamline development and bring-up.
  • Wide supply and temperature window: 2.7 V–3.6 V supply range and −40 °C to 85 °C operating range fit common system power rails and environmental requirements.

Why Choose IC FLASH 512MBIT PAR 63VFBGA?

The NAND512W3A2BZA6E positions itself as a high-density, parallel NAND flash option for designers needing compact, boot-capable non-volatile storage. Its combination of 512 Mbit capacity, fast sequential access, copy-back programming and power-up boot support addresses both mass-storage and embedded system requirements.

With documented endurance (100,000 P/E cycles), long data retention, and available development tools (ECC models, wear-leveling and demo hardware), this device is suitable for engineers seeking a verifiable solution for storage, boot memory and data-logging applications where footprint, integration and data integrity are priorities.

Request a quote or submit a product inquiry to receive pricing, availability and integration support for the NAND512W3A2BZA6E.

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